Patents Assigned to Waffer Technology Corp.
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Patent number: 7190576Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.Type: GrantFiled: June 21, 2004Date of Patent: March 13, 2007Assignees: Waffer Technology Corp.Inventors: Jack Wang, Charles Ma, Michael Lin
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Patent number: 7069737Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.Type: GrantFiled: April 20, 2004Date of Patent: July 4, 2006Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 7019979Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.Type: GrantFiled: November 21, 2003Date of Patent: March 28, 2006Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 6968889Abstract: A heat dissipating device includes a fastening structure and a heat sink. The heat sink has a thermal conductive base which has a top surface and two T-shape slots formed at two opposing ends of the top surface. The fastening structure has a pair of brackets. Each of the brackets has a planar plate and a T-shape arm to be inserted into the corresponding T-shape slot. The T-shape arms are hinged with one end of the planar plates, such that when the T-shape arms are inserted into the T-shape slots, the planar plates extend horizontally at a level lower than the top surface of the base. Each of the planar plates has a through hole through which the fastening structure can be mounted to a board by a fastener.Type: GrantFiled: November 21, 2003Date of Patent: November 29, 2005Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 6729523Abstract: A nail cartridge structure for a nail gun has at least two nail cartridges and a nail cartridge switching unit that is connected to a front end of the gun body. The nail cartridges are used to hold either one size of nails or different sizes of nails, respectively. The nail cartridge switching unit is connected to the nail cartridges and is operated by the user to selectively switch the nail feed to the desired nail cartridge.Type: GrantFiled: November 21, 2002Date of Patent: May 4, 2004Assignee: Waffer Technology Corp.Inventors: Jack Wang, Wen Tai Chou, Liang Ming Lin
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Patent number: 6672379Abstract: A radiator with positioning and buckling structure includes multiple metal plates, each of which has a main body, and a folded side portion is connected to one or two sides of the main body. The positioning and buckling structure is disposed on each of the metal plates. The positioning and buckling structure includes a snapping piece extending from the folded side portion. The snapping piece has a cleaved groove thereon and at two sides of the snapping piece there is provided two hooking portions. A buckling slot is disposed on the folded side portion of the metal plate corresponding to the snapping piece. The buckling slot is connected to a rear opening having a smaller width than the width of the snapping piece so that the metal plates can be stacked together.Type: GrantFiled: July 29, 2002Date of Patent: January 6, 2004Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 6607028Abstract: A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion connected to one or two sides of the main body. The positioning structure is disposed on each of the metal plates. The positioning structure comprises a protrusion located on the main body of the metal plate, an aperture being formed on the main body, the protrusion formed in the aperture; and a resilient snapping piece located on the folded side portion, the snapping piece corresponding to the protrusion and defining a buckling opening therein, the buckling opening being connected to a front opening having a width normally smaller than the width of the protrusion.Type: GrantFiled: July 29, 2002Date of Patent: August 19, 2003Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 6595275Abstract: A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.Type: GrantFiled: July 2, 2002Date of Patent: July 22, 2003Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 6571862Abstract: A heat dissipation fin includes multiple unit each having a top, a first side and a second side and multiple bridges each connecting every two adjacent units together and connected to each one of the units at a fold. The bridge has a front side and a rear side and the top of the unit has a first side in parallel with the front side and a second side in parallel with the rear side of the bridge. Each front side has a width smaller than a width of each rear side and each first side has a width smaller than a width of each second side.Type: GrantFiled: June 25, 2002Date of Patent: June 3, 2003Assignees: Waffer Technology Corp.Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
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Patent number: 6477045Abstract: A heat dissipater for a CPU (Central Processing Unit) includes an upper block and a lower block abutting each other. The upper block has a series of fins extending upward from a first side of the upper block and a recess defined in a second side of the upper block. The lower block includes a first side having a recess defined to correspond to the recess in the upper block and forming a closed chamber with the recess in the upper block and a second side adapted to abut the CPU. Volatile liquid is received in the closed chamber to promote the heat dissipation of the heat dissipater for a CPU.Type: GrantFiled: December 28, 2001Date of Patent: November 5, 2002Assignees: Waffer Technology Corp.Inventor: Tien-Lai Wang