Abstract: A conductor connection contact element for clamping an electrical conductor having at least one resilient force clamping connection. At least one first SMD-solder contact is arranged on an assembly face of the conductor connection contact element and configured for soldering to a contact surface. A conductor inserting region is formed by a sheet metal part of the conductor connection contact element. At least one conductor guiding base is oriented so as to form a guiding surface for the electrical conductor that is to be inserted. A material portion of the sheet metal part is adapted to be bent over at least one curved region to form a first SMD-solder contact and a region of the conductor guiding base that is oriented in an oblique manner with respect to the conductor inserting direction is adjacent to the at least one curved region.