Patents Assigned to Wako Seiki Co., Ltd.
  • Patent number: 7585194
    Abstract: A conductor pin placed between one member and another member and contacting the both members to electrically connect the members to each other. The conductor pin includes a tubular outer pin portion formed by folding a conductive plate material for the outer pin portion, a tubular inner pin portion formed by folding a conductive plate material for the inner pin portion and inserted in the outer pin portion slidably in the axial direction of the outer pin portion, and a conductive spring disposed in the outer pin portion and inserted in the inner pin portion to urge the inner pin portion in a direction in which the inner pin portion projects from the outer pin portion.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: September 8, 2009
    Assignee: Wako Seiki Co., Ltd.
    Inventor: Kunio Ito
  • Publication number: 20070224889
    Abstract: A conductor pin placed between one member and another member and contacting the both members to electrically connect the members to each other. The conductor pin includes a tubular outer pin portion formed by folding a conductive plate material for the outer pin portion, a tubular inner pin portion formed by folding a conductive plate material for the inner pin portion and inserted in the outer pin portion slidably in the axial direction of the outer pin portion, and a conductive spring disposed in the outer pin portion and inserted in the inner pin portion to urge the inner pin portion in a direction in which the inner pin portion projects from the outer pin portion.
    Type: Application
    Filed: May 17, 2005
    Publication date: September 27, 2007
    Applicant: WAKO SEIKI CO., LTD.
    Inventor: Kunio Ito
  • Patent number: 6094125
    Abstract: A thin plate stack assembly formed by stacking a plurality of metallic thin plates and connecting the thin plates to one another, wherein each thin plate comprises a slit and formed leaf which is formed by press working to downwardly slit and form a partial area which is surrounded by an outer edge which is a part of the outer periphery of a thin plate, side edges extending by a certain length toward the inside from both ends of the outer edge, and an inner edge connecting the inside ends of the side edges to each other, and which is bent obliquely downward from said thin plate at the location of said inner edge. The side edges are cut from the thin plate, and a slit and formed hole formed behind the slit and formed leaf, and the slit and formed leaf of each thin plate is inserted into the slit and formed hole in a thin plate disposed just under the thin plate in force fitting for connecting the upper and lower thin plates to each other.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: July 25, 2000
    Assignee: Wako Seiki Co., Ltd.
    Inventor: Kunio Ito