Abstract: A ceramic pedestal assembly and a method of forming a ceramic pedestal assembly is provided. The ceramic pedestal assembly includes a ceramic substrate defining an upper surface and a lower surface, at least one via extending through the ceramic substrate, an upper conductive foil layer extending across the upper surface of the ceramic substrate and a lower conductive foil layer extending across the lower surface of the ceramic substrate. Each via includes an upper via defining a cavity and a lower via defining a corresponding tapered insert. In one form, the upper via, the lower via, and the conductive foil layers define a material having a melting temperature greater than 2,000° C. and a CTE less than or equal to the ceramic substrate.

Abstract: An instrumented heater sleeve is provided that has a plurality of zones, a dielectric layer disposed over an outer surface of the sleeve, a resistive element layer disposed over the first dielectric layer, and a plurality of pairs of lead wires secured to a portion of the resistive element layer. Each pair of lead wires is connected to and corresponds with each of the zones and a protective layer is disposed over the dielectric layer. An amount of power is supplied to each of the zones and adjusted during a test run, or multiple test runs, to achieve a desired temperature profile along a heating target such as a hot runner nozzle. Methods of designing a hot runner nozzle heater using the instrumented heater sleeve are also provided.