Patents Assigned to Waltow Polymer Technologies
  • Patent number: 6392206
    Abstract: A modular fluid heating apparatus may be assembled from a plurality of modular heating components. Each modular heating component includes a first molded section defining a first opening therethrough and a second molded section defining a second opening therethrough. The molded sections are mated and define an enclosed area between the molded sections. The first and second openings are aligned to form a fluid tight passage through the modular heating component. A resistance heating element is secured between the first and second molded sections in the enclosed area. The resistance heating element includes a supporting substrate having a first surface thereon and an electrical resistance heating material fastened to the first surface of the supporting substrate. The resistance heating material forms a predetermined circuit path having a pair of terminal end portions fixed to a pair of electrical connectors.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: May 21, 2002
    Assignee: Waltow Polymer Technologies
    Inventors: Theodore Von Arx, Keith Laken