Patents Assigned to Warmilu, LLC
  • Patent number: 9605874
    Abstract: A heat pack includes a housing, a first phase change material (PCM) that is contained in the housing, and a thermal storage buffer that is contained in the housing. The thermal storage buffer includes a second PCM. An initiator is in operative contact with the first PCM. Activation of the initiator causes crystallization of the first PCM, and the first PCM cooperates with the thermal storage buffer to provide heat at a predetermined temperature range upon crystallization of the first PCM.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: March 28, 2017
    Assignee: Warmilu, LLC
    Inventors: Rachel Lynn Rademacher, Weidong Chen, Grace Hsia
  • Publication number: 20140261380
    Abstract: A heat pack includes a housing, a first phase change material (PCM) that is contained in the housing, and a thermal storage buffer that is contained in the housing. The thermal storage buffer includes a second PCM. An initiator is in operative contact with the first PCM. Activation of the initiator causes crystallization of the first PCM, and the first PCM cooperates with the thermal storage buffer to provide heat at a predetermined temperature range upon crystallization of the first PCM.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Warmilu, LLC
    Inventors: Rachel Lynn Rademacher, Weidong Chen, Grace Hsia