Abstract: A phase-locking oscillator circuit having improved phase noise characteristics is disclosed herein. The oscillator circuit includes a tuned oscillator for providing a carrier signal at a tunable carrier frequency. The carrier signal is applied to an input port of a phase modulator operative to impress an RF signal upon output terminal. An error detection and feedback network generates an error signal by comparing a predefined characteristic of the RF output signal to a reference signal. The network includes a loop filter arrangement which operates upon the error signal so as to provide a tuned oscillator tuning signal to a tuning port of the tuned oscillator and a modulator control signal to a control port of the phase modulator. In an exemplary implementation the error detection and feedback network includes a phase detector for generating the error signal in response to the phase difference between the RF output signal and the reference signal.

Abstract: A method for depositing silicon dioxide on the surface of a substrate or the like using a nitrogen-containing precursor is disclosed herein. In a preferred implementation the deposition is performed using an atmospheric pressure reactor, into which is directed toward the substrate surface a stream of source gas comprised of ozonated oxygen. A stream of a nitrogen-containing precursor such as, for example, hexamethyldisilazane (HMDS) is also directed into the reactor toward the substrate surface. In addition, a stream of a nitrogen-containing separator gas is directed into the reactor between the streams of precursor and source gases. The inventive deposition method has been shown to result in improved film nucleation on a variety of substrate surfaces.

Abstract: High-frequency limiter and switch-limiter circuits having reduced insertion loss and improved recovery time are disclosed herein. The high-frequency switch-limiter includes at least one input port and a high-frequency signal path between the input port and a common arm. An input diode generates a first bias current in response to incidence upon the input port of high-energy signals in excess of a predefined power level. A set of protection diodes reflects the high-energy signals upon being switched to an ON state by a portion of the first bias current or by a second bias current, with the protection diodes being disposed to reflect signal energy propagated by the high-frequency signal paths when in the ON state and to pass signal energy propagated by the high-frequency signal paths when in an OFF state.

Abstract: A reflow furnace in which the rate at which the temperature of the parts being processed can change can be varied throughout the furnace in order to provide a high initial rise rate, a period of low or no rise, and a very fast rise to a temperature above the melting point of solder followed by a fast drop to a temperature below the melting point of the solder. The entire operation is performed in an atmosphere of air, inert gas, active gas, or combustible gas. In a stabilization zone and a reflow zone, the primary heating mode is forced, controlled convection that is perpendicular to surface of an assembly to be soldered.

Abstract: A MIC package housing that reduces or completely eliminates alumina substrate cracking due to thermal expansion rate differences between the housing and the alumina by using a low-expansion iron-nickel alloy, such as commercially available Carpenter 49, made to ASTM Specification A-753-78 (Alloy 2) and MIL-N-14411B (MR) (Composition 3 and 4). Such a housing places compressive stresses no glass-to-metal seals used in hermetic feedthroughs and the glass is fused and the stresses relieved by a special process of annealing. Manufacturing yields are improved and very large alumina substrates can be used and are attached by hard soldering.

Abstract: A high percentage bandwith microwave filter network, according to an embodiment of the present invention, comprises a T-network of capacitors implemented with thin-film techniques by applying a groundplane to one side of an alumina substrate and a first plate to the other side. A silicon nitride dielectric layer having a high density of capacitance is deposited over the first plate, and then a second and third capacitor plate are deposited on the dielectric over the first plate.

Abstract: A hermetically sealed radio frequency feedthrough device is disclosed. The feedthrough includes a first ring of a glass material which bonds to a radio frequency device housing when heated. A second ring is also provided, the second ring does not melt and thereby contains the glass material to desired areas during heating.

Abstract: What is disclosed is an injector of the type commonly used in atmospheric pressure chemical vapor deposition equipment. The injector includes a number of plates with a number of linear hole arrays. The plates are layered in order to produce a number of cascaded holes arrays. The layered plates define a hole matrix. A chute is positioned beneath the hole matrix. On both sides of the chute is a cooling plate. The chute includes a passage, the regions between the cooling plate and the chute form ducts. The top of the hole matrix receives a number of gases and discretely conveys them to the top of the individual cascaded hole arrays. The gaseous chemicals are then forced through the cascaded hole arrays which induces the gases to flow in an increasingly uniform manner. The gases are then individually fed to the passage and ducts which convey them to a region above the surface where the gases are exposed to one another, react and form a layer on the surface.

Abstract: An atmospheric pressure chemical vapor deposition (APCVD) system for doping indium-oxide films with both tin and fluorine to produce dual electron donors in a non-batch process. The APCVD system has a conveyor belt and drive system for continuous processing through one or more reaction chambers separated by nitrogen purge curtains. A substrate passing through the system enters a muffle heated by several heaters and the reaction chambers are supplied by a source chemical delivery system comprising an oxidizer source, a fluorine chemical source, a nitrogen source, rotometers for the above sources, a mass flow controller, a tin chemical bubbler, heated lines, an indium chemical bubbler, a pair of water baths with heaters, and associated valving.

Abstract: A TO-8 surface-mount package assembly for R.F. and microwave devices is disclosed. The assembly includes a lead-frame positioned beneath an alumina base. The alumina base supports a number of solid metal vias. The vias electrically connect the lead-frame to an R.F. or microwave device which is attached to the vias. The assembly also includes a gold plated Kovar seal-ring positioned over the base. The seal-ring and base are brazed together. A cover is then positioned over the seal-ring and welded to the seal-ring.

Abstract: A self cleaning flow control orifice mounted in an exhaust line. A toroid having a rounded inner surface is mounted in the exhaust line and forms an orifice. A cleaning device is mounted in a manner to provide close contact between the cleaning device and the rounded surface. The toroid and cleaning device are rotated relative to one another so that the cleaning device rides over the rounded surface to clean the surface. The clean surface thereby insures proper functioning of the exhaust system of an atmospheric pressure chemical vapor deposition apparatus used to deposit films on substrates and wafers.

Abstract: A MIC package housing that reduces or completely eliminates alumina substrate cracking due to thermal expansion rate differences between the housing and the alumina by using a low-expansion iron-nickel alloy, such as commercially available Carpenter 49, made to ASTM Specification A-753-78 (Alloy 2) and MIL-N-14411B (MR) (Composition 3 and 4). Such a housing places compressive stresses on glass-to-metal seals used in hermetic feedthroughs and the glass is fused and the stresses relieved by a special process of annealing. Manufacturing yields are improved and very large alumina substrates can be used and are attached by hard soldering.

Abstract: An electrically insulating pipe coupling assembly for electrically isolating pipe sections to which an electric current is applied. The apparatus includes first and second extension members formed having an integral flange with a protruding annular sealing bead at one end and adapted for attachment to a section of pipe at the other end. An insulating sleeve having an insulating flange is mounted on the first extension member. A nonconductive spacer is positioned between the opposing integral flanges to receive the annular sealing beads, separating and electrically isolating the first and second extension members. A first coupling member is slidably mounted on the insulating sleeve, while a second coupling member is slidably mounted on the second extension member. The coupling members, when secured together, force the annular sealing beads into compressive contact with the nonconductive spacer.

Abstract: An improved bubbler has walls formed of thin stainless steel. A hollow cylindrical body member forms a cylindrical sidewall and has welded to it a top end cap and a bottom end cap. A horizontally disposed sparger tube is connected to the carrier-gas inlet tube and is positioned within the bubbler chamber adjacent to the bottom end cap. The sparger tube has a plurality of horizontally spaced-apart exit holes formed therein for providing a plurality of carrier-gas streams into the liquid chemical. The carrier gas bubbles up through the liquid chemical, causing the liquid chemical to vaporize and diffuse into the carrier gas. A substantially uniform temperature throughout the chemical liquid is provided with a heat-conductive enclosure formed of aluminum plates which are thicker than the walls of the bubbler chamber and which contact and entirely surround the exterior surface of the stainless steel bubbler chamber.

Abstract: A module having a microwave circuit carrier with ribbon conductors for both the fifty ohm transmission line and ground connections. The carrier has a platform raised from the floor of the carrier at the outside interfacing edges. A ribbon conductor is welded between the raised lips on abutting carriers to form a uniform ground plane accessible to top assembly. A second ribbon is welded between RF conductors on substrates in the respective carriers and spans over the interface and the ribbon ground plane. By proper choice of ribbon conductor widths and the spanning height above the ground plane, a fifty ohm impedance can be maintained.

Abstract: A heater assembly and method of operation for use in processing of a substrate such as a semiconductor wafer, for example in a chemical vapor deposition (CVD) reactor chamber, the heater assembly including a dielectric heater base, radially spaced apart and circumferentially extending heater element segments being arranged on the heater base, operation of the plurality of heater elements being independently regulated, a heater shroud being arranged in spaced apart relation over the heater elements while supporting the substrate for maintaining a blanket of inert gas between the heater elements and the heater shroud. Inert gas is preferably introduced through a central opening in the heater base and is selectively regulated for facilitating processing of the substrate.

Abstract: A liquid level sensor assembly for a liquid-chemical bubbler includes a removable cylindrical LED housing, which is removably retained within a cylindrical axial bore of a sealing nut. The LED housing is removable from within the cylindrical axial bore without breaking the seal between the chemical liquid within the bubbler and the ambient atmosphere. The LED housing holds an LED transmitter and a photodiode detector, which respectively sends light into a cylindrical quartz rod and receives reflected light from the quartz rod, where the reflected light is used to measure the level of the chemical liquid within the bubbler.

Abstract: A chemical vapor deposition (CVD) reactor and method are disclosed wherein a chamber, preferably configured for receiving a single wafer as a deposition substrate, has multiple gas inlet orifices and exhaust ports which are independently adjustable for dynamically varying and controlling directionality of local gas flow vectors toward and past the deposition substrate. The injection angle of reactant gas being introduced into the chamber is adjusted by baffles for statically deflecting gas flow entering the chamber. Adjustment of the gas inlet orifices and/or exhaust ports and adjustment of the injection angle for the reactant gas is selected for achieving enhanced coating uniformity, and conformality of deposition if necessary or desired, on the substrate.

Abstract: Apparatus for polishing spherical objects includes first and second plates having smooth facing surfaces. A first plate comprises ceramic material which is rotatably supported, and the first plate includes a transparent plate. Spherical objects to be polished are placed between the two plates along with an abrasive slurry, and magnets are positioned on a top surface of the first plate to magnetically limit the path of travel of the spherical objects as the second plate is rotated. The first plate includes at least one radially concave groove in which this spherical objects are mixed during a polishing operation.

Abstract: Disclosed is a microwave notch filter which includes a plurality of serially connected YIG tuned resonators, each YIG resonator including a coupling wire and a PIN diode connected in parallel with the coupling wire. A first interconnect interconnects one end of the plurality of serially connected YIG resonators to an RF signal source, and a second inter-connect interconnects another end of the plurality of serially connected YIG band reject filters to a load. An inductor connects one of the interconnects to a circuit ground potential, and an inductor means connects the other interconnect to a DC voltage source, whereby the PIN diodes in the YIG resonators can be forward-biased or reverse-biased by an applied DC voltage. The DC voltage source selectively provides a positive DC voltage and a negative DC voltage which effectively controls the functioning of said YIG band reject filters.