Patents Assigned to WAVECONNEX, INC.
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Publication number: 20140281534Abstract: A communication device employs a contactless secure communication interface to transmit and receive data with a computing device using close proximity extremely high frequency (EHF) communication. The communication device and the computing device periodically initiate a discovery operation mode, whereby the devices periodically transmit identifying information about the respective devices and listen for identifying information from the other device. Upon completion of the discovery mode operation, the devices enter a link-training operation mode and exchange capability information about the respective devices. During transport mode operation the communication device employs methods to manage access to data stored on the communication device by encrypting the data using one or a combination of training information or capability information as a basis for generating an encryption key.Type: ApplicationFiled: December 19, 2013Publication date: September 18, 2014Applicant: WaveConnex, Inc.Inventors: Gary Davis McCormack, Ian A. Kyles
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Publication number: 20140273853Abstract: Docked devices communicate wirelessly and in close proximity using multiple transmitters of Extremely High-Frequency (EHF) signals of 30-300 GHz. The devices may not be precisely aligned when docked. Tolerance of misalignment is improved by adding barriers such as solid metal blocks or rows of metal-filled vias that have a spacing of less than one-quarter the EHF wavelength. The barriers reflect EHF radiation and prevent EHF radiation from penetrating the barrier. Barriers placed between adjacent transmitters and receivers block stray electromagnetic radiation from causing cross-talk. The barriers can be placed closer to the transmitters than to the receivers to allow for a wider area for reception, permitting a wider misalignment. EHF reflecting features such as ground planes spaced a quarter-wavelength apart may be added to an end of a substrate near a connecting edge to act as a barrier and reflect electromagnetic radiation back toward an intended receiver.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: WAVECONNEX, INC.Inventors: Roger Isaac, Gary Davis McCormack, Ian A. Kyles
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Publication number: 20140273856Abstract: Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: WAVECONNEX, INC.Inventors: Ian A. Kyles, Ken Kveton, Mike Bourdess, John Wolcott, Steve Novak, Roger D. Isaac, Gary D. McCormack
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Patent number: 8757501Abstract: A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.Type: GrantFiled: March 4, 2013Date of Patent: June 24, 2014Assignee: WaveConnex, Inc.Inventors: Gary D. McCormack, Ian A. Kyles
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Patent number: 8714459Abstract: A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.Type: GrantFiled: May 14, 2012Date of Patent: May 6, 2014Assignee: WaveConnex, Inc.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20140038521Abstract: Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.Type: ApplicationFiled: October 7, 2013Publication date: February 6, 2014Applicant: WaveConnex, Inc.Inventor: Gary D. McCormack
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Publication number: 20130308501Abstract: A communication device includes an EHF communication unit, a data signal line, and a protocol bridge element. The EHF communication unit includes a transceiver, and an antenna coupled to the transceiver. The data signal line carries a data signal conforming to a first communication protocol. The protocol bridge element is coupled to the data signal line and EHF communication unit, and configured to receive a first protocol-compliant data signal from the data signal line, translate the first protocol-compliant data signal to an outbound binary signal, time-compress the outbound binary signal, and transmit the outbound time-compressed signal to the transceiver. The protocol bridge element is further configured to receive an inbound time-compressed signal from the transceiver, time-decompress inbound time-compressed signal to an inbound binary signal, translate inbound binary signal to conform to a second communication protocol, and provide second protocol-compliant signal to the first data signal line.Type: ApplicationFiled: March 4, 2013Publication date: November 21, 2013Applicant: WAVECONNEX, INC.Inventor: WaveConnex, Inc.
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Patent number: 8554136Abstract: Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.Type: GrantFiled: December 21, 2009Date of Patent: October 8, 2013Assignee: WaveConnex, Inc.Inventor: Gary D. McCormack
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Publication number: 20130196598Abstract: Establishing a communication link may include transmitting by a first device an unmodulated first electromagnetic EHF signal and receiving by a second device the first electromagnetic EHF signal. The second device may determine whether the received first electromagnetic EHF signal indicates that a first shield portion and a second shield portion are in alignment. The transmission of a modulated second electromagnetic EHF signal may be enabled when the received first electromagnetic EHF signal indicates that both the shield portions are in alignment. The transmission of a modulated second signal may be disabled when the received first electromagnetic EHF signal indicates that the first and second shield portions are not in alignment.Type: ApplicationFiled: January 30, 2013Publication date: August 1, 2013Applicant: WAVECONNEX, INC.Inventor: WAVECONNEX, INC.
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Publication number: 20130157477Abstract: A first connector may include a housing defining a first connector face to be positioned in a first position or a second position proximate to a second connector face of a second connector. A first extremely high frequency (EHF) communication unit may be disposed in the housing for communicating with a second EHF communication unit of the second connector when the first connector face is positioned in first or second position relative to the second connector face. A first magnet may be disposed in the housing. The first magnet may align with and repel a second magnet disposed relative to the second connector face when the first connector face is positioned in the second position. The first magnet may be configured not to align with and not to repel the second magnet when first connector face is positioned in the first position relative to the second connector face.Type: ApplicationFiled: December 13, 2012Publication date: June 20, 2013Applicant: WAVECONNEX, INC.Inventor: WAVECONNEX, INC.
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Publication number: 20130106673Abstract: An electronic device may include a PCB having a substantially planar surface and one or more electronic components mounted thereon. A first EHF communication unit may be mounted on the substantially planar surface of the PCB. The first EHF communication unit may include a first planar die containing a first communication circuit, the first die extending along the substantially planar surface of the PCB in a die plane. A first antenna may be operatively connected to the first circuit by interconnecting conductors, the first antenna being configured to at least one of transmit and receive electromagnetic radiation along a plane of the substantially planar surface of the PCB. The first EHF communication unit may have an uppermost surface having a height from the substantially planar surface of the PCB, the first EHF communication unit height being determined by an uppermost surface of the die, the first antenna, and the interconnecting conductors.Type: ApplicationFiled: October 22, 2012Publication date: May 2, 2013Applicant: WAVECONNEX, INC.Inventor: WaveConnex, Inc.
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Publication number: 20130109303Abstract: A first electronic device may include a first electronic circuit and a second electronic circuit is provided. The first electronic device may include an internal communication link providing a signal path for conducting communication signals between the first electronic circuit and the second electronic circuit. An interface circuit may be operatively coupled to the internal communication link. The interface circuit may include an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from another EHF communications circuit of a second electronic device. This EHF electromagnetic signal may enable the second electronic device to control or monitor the first electronic device.Type: ApplicationFiled: October 22, 2012Publication date: May 2, 2013Applicant: WAVECONNEX, INC.Inventor: WaveConnex, Inc.
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Publication number: 20120319496Abstract: A system for sensing proximity using EHF signals may include a communication circuit configured to transmit via a transducer an EM signal at an EHF frequency, and a proximity sensing circuit configured to sense a nearby transducer field-modifying object by detecting characteristics of a signal within the communication circuit. A system for determining distance using EHF signals may include a detecting circuit coupled to a transmitting communication circuit and a receiving communication circuit, both communication circuits being mounted on a first surface. The transmitting communication circuit may transmit a signal toward a second surface, and the receiving communication circuit may receive a signal relayed from the second surface. The detecting circuit may determine distance between the first surface and a second surface based on propagation characteristics of the signals.Type: ApplicationFiled: June 15, 2012Publication date: December 20, 2012Applicant: WAVECONNEX, INC.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20120319890Abstract: A system for sensing proximity using EHF signals may include a communication circuit configured to transmit via a transducer an EM signal at an EHF frequency, and a proximity sensing circuit configured to sense a nearby transducer field-modifying object by detecting characteristics of a signal within the communication circuit. A system for determining distance using EHF signals may include a detecting circuit coupled to a transmitting communication circuit and a receiving communication circuit, both communication circuits being mounted on a first surface. The transmitting communication circuit may transmit a signal toward a second surface, and the receiving communication circuit may receive a signal relayed from the second surface. The detecting circuit may determine distance between the first surface and a second surface based on propagation characteristics of the signals.Type: ApplicationFiled: June 15, 2012Publication date: December 20, 2012Applicant: WAVECONNEX, INC.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20120307932Abstract: A system for communicating modulated EHF signals may include a modulation circuit responsive to a bi-level transmit information signal for generating a transmit output signal. The transmit output signal may have an EHF frequency when the transmit information signal is at a first information state and may be suppressed when the transmit information signal is at a second information state. A transmit transducer operatively coupled to the modulation circuit may be responsive to the transmit output signal for converting the transmit output signal into an electromagnetic signal.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Applicant: WAVECONNEX, INC.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20120295539Abstract: A system for transferring electrical signals while providing electrical isolation may include a first circuit and a second circuit electrically isolated from the first circuit. The first circuit may provide a first electrical signal path for conveying a transmit electrical signal and including a first EHF communication unit. The first EHF communication unit may be configured to receive the transmit electrical signal and to electromagnetically transmit an electromagnetic EHF signal representative of the electrical signal. The second circuit may provide a second electrical signal path and including a second EHF communication unit. The second EHF communication unit may be configured to electromagnetically receive the transmitted electromagnetic EHF signal, extract a received electrical signal from the received electromagnetic EHF signal, and apply the received electrical signal to the second electrical signal path.Type: ApplicationFiled: July 3, 2012Publication date: November 22, 2012Applicant: WAVECONNEX, INC.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20120290760Abstract: A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.Type: ApplicationFiled: May 14, 2012Publication date: November 15, 2012Applicant: WAVECONNEX, INC.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20120286049Abstract: A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.Type: ApplicationFiled: May 14, 2012Publication date: November 15, 2012Applicant: WAVECONNEX, INC.Inventors: Gary D. McCormack, Ian A. Kyles
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Publication number: 20120263244Abstract: A system for transmitting or receiving signals may include an integrated circuit (IC), a transducer operatively coupled to the IC for converting between electrical signals and electromagnetic signals; and insulating material that fixes the locations of the transducer and IC in spaced relationship relative to each other. The system may further include a lead frame providing external connections to conductors on the IC. An electromagnetic-energy directing assembly may be mounted relative to the transducer for directing electromagnetic energy in a region including the transducer and in a direction away from the IC. The directing assembly may include the lead frame, a printed circuit board ground plane, or external conductive elements spaced from the transducer. In a receiver, a signal-detector circuit may be responsive to a monitor signal representative of a received first radio-frequency electrical signal for generating a control signal that enables or disables an output from the receiver.Type: ApplicationFiled: March 22, 2012Publication date: October 18, 2012Applicant: WAVECONNEX, INC.Inventors: Ian A. Kyles, Gary D. McCormack