Abstract: The present invention discloses a system for improving power management for spatial power combining systems, such as a quasi optical grid array amplifier. One aspect of the invention includes the provision of a patterned conductor on the surface the semiconductor chip that opposes the surface upon which the active devices are disposed. This metal material can be used to both enhance heat removal from the chip and to provide a new and more efficient DC biasing path (with the use of vias) for the active components on the other (front) surface of the chip. Another aspect of the invention is the introduction of a dielectric superstrate that attaches to the front surface of the chip to provide an alternative or complementary heat removal and/or biasing structure to the conventional substrate that is typically attached to the back side of the chip. Various combinations of the above features are disclosed.

Abstract: The present invention discloses a system for integrating a quasi-optical reflection-mode array into a wave-guiding enclosure. The system includes a quasi-optical reflection mode array and a waveguide assembly that encloses and mounts therein the array. In one preferred embodiment, the waveguide assembly includes an array mounting section into which the array is mounted, a first energy coupling section, a second energy coupling section and a three-port waveguide section. The wave-guiding section has a first port connected to the first energy coupling section, a second port connected to the second energy coupling section, and a third port connected to the array mounting section.