Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded conductive elements are coupleable to a grounded layer and to the EMI shield and provides improved EMI shielding through the volume of the printed circuit board below an electronic component mounted on the printed circuit board.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: The present invention includes improved RFID antennae and tags and methods of manufacturing the RFID antennas. The RFID tags of the present invention include a substrate that comprises an antenna assembly. A radiofrequency integrated circuit is in electrical communication with a portion of the antenna assembly. The RFID tag may include a structure, such as a lid element, that clamps and/or compresses the radiofrequency integrated circuit into contact with the antenna assembly, without the need for a conductive adhesive. In some embodiments, the antenna assembly is vacuum metallized or otherwise applied onto the substrate through patterned openings in a mask, such as a patterned masking cliché or a patterned polymer layer.

Abstract: An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

Abstract: An RFID antenna that is protected from corrosion and is configured for easy attachment to an electronic chip is very advantageous. The electrically conductive RFID antenna pattern is coated with a layer of solderable material that protects the copper from corroding. The solderable material has a low melting temperature so that the solderable material can be heated to form a weld joint between a chip and the solderable material without damaging the chip.

Abstract: An electromagnetic interference shield includes a polymer thin film metalized with conductive metals and a solderable material deposited over the conductive metals. The solderable material has a low melting temperature so that the solder can be heated to form a weld joint between a chip (or component) and the solder without damaging the metalized polymer thin film. One example of a low melting temperature solder is SnBi.

Abstract: An RFID smart label includes a plurality of layers, wherein one of the plurality of layers is an RFID inlay with a depression/recession region for holding the RFID chip/strap so that it does not extend above the surface of the antenna. The depressed/recessed region can have substantially the same depth as the thickness of the RFID chip/strap. High speed printing processes are then used to economically print labels on the RFID inlays having the RFID chip/strap embedded because there are no bumps to impede the printing process.

Abstract: An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

Abstract: The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at least a portion of a perimeter of the EMI shield. One or more connectors coupled to the flange removably contact the flange to a ground trace of the printed circuit board.

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at least a portion of a perimeter of the EMI shield. One or more connectors coupled to the flange removably contact the flange to a ground trace of the printed circuit board.

Abstract: The present invention provides improved RFID antennae and tags and methods of manufacturing the RFID antennas. The RFID tags of the present invention include a substrate that comprises an antenna assembly. A radiofrequency integrated circuit is in electrical communication with a portion of the antenna assembly. The RFID tag may include a structure, such as a lid element, that clamps and/or compresses the radiofrequency integrated circuit into contact with the antenna assembly, without the need for a conductive adhesive. In some embodiments, the antenna assembly is vacuum metallized or otherwise applied onto the substrate through patterned openings in a mask, such as a patterned masking cliché or a patterned polymer layer.

Abstract: The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.