Patents Assigned to Wayve, Inc.
  • Patent number: 11813816
    Abstract: The present disclosure describes molded footwear including a sole integrally connected to an upper. For example, a sole structure may include an insole and a strobel board. The insole may include a spacing structure that rests on a top surface of the strobel board to form a cavity between the insole and the strobel board. Further, the upper and/or strobel board may include perforations at least partially aligned with the cavity. Accordingly, the sole structure may be connected to the upper via injection molding material into the cavity formed between the insole, the strobel board, and the upper. The molding material may flow through the specifically located perforations in the shoe's upper and/or the shoe's strobel board such that the material bonds internally within the cavity, internally within the perforations, and externally to the shoe's upper and strobel board but within the mold cavity.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: November 14, 2023
    Assignee: Wayve, Inc.
    Inventors: Samuel S. Andrews, Alexandra B. Joelson, Jack A. Browers, Shahwaz Khan