Abstract: Provided is a pad type wafer test apparatus comprises a disk-shaped substrate, a buffer assembly comprising a cross-shaped seat, a body, a buffer pad, and a rectangular frame element, a conductive assembly, and a rectangular test probe mechanism provided between the body and the conductive member and electrically coupled thereto. In a conductivity test for finding any defect in wafer a wafer is placed on a machine, the test probe mechanism is placed on the wafer with test probes of the test probe mechanism being in contact with the wafer by inserting into an oxidized film on the wafer, and test result is transmitted to a display via the test probes and the substrate. The invention can accurately find any wafer defect, protect test probes, and effect a dense configuration of test probes.