Patents Assigned to Weifang Goertek Microelectronics Co., Ltd.
  • Publication number: 20210021937
    Abstract: An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode
    Type: Application
    Filed: September 27, 2018
    Publication date: January 21, 2021
    Applicant: WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    Inventors: Dexin WANG, Huabin FANG, Qinglin SONG
  • Patent number: 10866667
    Abstract: A touch pressure control method and device are provided. The touch pressure control method comprises: determining, according to a first pressure value and a second pressure value generated in response to a single touch operation, a pressure level and a touch point position corresponding to the touch operation; and selecting, according to the pressure level and the touch point position, a corresponding function or application from a function and application list, and controlling an implementation of the function or application.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: December 15, 2020
    Assignee: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Wentao Wang, Tianduo Zhou, Zhongkai Li
  • Patent number: 10848865
    Abstract: A method and device for sound source positioning using a microphone array. The method comprises: determining a horizontal axis that a microphone array rotates around as a reference axis; calculating, according to a sound emitted by a sound source that is collected by the microphone array, to obtain a first sound source estimated value indicating a sound source position in a three-dimensional space; acquiring an inclination angle between a plane in which the microphone array is located when it is rotating and a horizontal plane in which the reference axis is located; and according to the first sound source estimated value and the inclination angle, calculating out a second sound source estimated value on a horizontal plane corresponding to the first sound source estimated value, and using the second sound source estimated value as the determined sound source position.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: November 24, 2020
    Assignee: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Jian Zhu, Xiangdong Zhang, Zhiping Luo, Dong Yan, Zhuo Chen
  • Patent number: 10773950
    Abstract: An MEMS microphone device and an electronics apparatus are provided. The MEMS microphone device comprises: a substrate; a MEMS microphone element placed on the substrate; a cover encapsulating the MEMS microphone element together with the substrate; and an acoustic port for the MEMS microphone element, wherein a compliant membrane is provided to seal the acoustic port, and the membrane has a mechanical stiffness lower than that of the diaphragm of the MEMS microphone element.
    Type: Grant
    Filed: October 8, 2016
    Date of Patent: September 15, 2020
    Assignee: WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    Inventor: Quanbo Zou
  • Patent number: 10760929
    Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: September 1, 2020
    Assignee: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Junkai Zhan, Mengjin Cai