Abstract: A method of making an electronic ceramic component. The method includes steps of terminating a ceramic body with a metalized terminal and encompassing a portion of the ceramic body by an insulating resin. The step of encompassing further comprises steps of preparing a liquid resin precursor, applying the liquid resin precursor to a surface of the ceramic body, thereby wetting the surface of the ceramic body while not wetting the metalized terminal, and curing the liquid resin precursor applied to the wetted surface of the ceramic body to form a resin coating covering the surface of the ceramic body after removing extra quantity of the liquid resin precursor from the not wetted metalized terminal. The liquid resin precursor comprises an element selected from a group consisting of resin solution or resin emulsion that has a surface tension adjusted by changing a resin precursor concentration.