Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An apparatus is provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.

Abstract: An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: A system and method are provided which provides more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heater or cooler to directly contact the IC package, and an electronic controller to receive signals from the temperature sensor. The electronic controller is programmed to change the temperature of the heater or cooler responsive to the measured surface temperature of the IC package. A plurality of cooling devices individually removes heat generated by the plurality of IC packages.

Abstract: An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC.

Abstract: An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC.

Abstract: An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged to receive two or more types of IC packages. A pressure unit is tiltably attached to the lid of the socket device providing a resilient normal force to each of the two or more IC packages without damaging the IC packages. The pressure unit has two or more pressure pads that correspondingly apply the resilient normal force to each of the two or more IC packages. The IC packages are received in recesses where the recesses are typically arranged in an array with the pressure pads in the pressure unit arranged so as to align with the array of recesses.

Abstract: An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.

Abstract: An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged to receive two or more types of IC packages. A pressure unit is tiltably attached to the lid of the socket device providing a resilient normal force to each of the two or more IC packages without damaging the IC packages. The pressure unit has two or more pressure pads that correspondingly apply the resilient normal force to each of the two or more IC packages. The IC packages are received in recesses where the recesses are typically arranged in an array with the pressure pads in the pressure unit arranged so as to align with the array of recesses.

Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Abstract: An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC.

Abstract: An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.