Abstract: Substrates and methods to fabricate and use millimeter wave Sievenpiper EBG structures such that the conductive portions are internal to an LTCC package.

Abstract: Electromagnetic slow wave structures (SWS) comprised of arrays of conductive obstacles are formed inside conductive parallel-plate waveguides These SWS may be formed using, for example, MEMS manufacturing processes at the wafer level on substrates including ceramic and silicon. An effective relative permittivity in the range of 15 to 40 may be obtained at millimeterwave frequencies. The SWS can be made absorptive by incorporating resistive losses in a plate of the PPW. Applications of these slow wave structures include delay lines and bootlace lens beamformers for microwave and millimeterwave antenna systems.

Abstract: An antenna system is described which is comprised of an artificial magnetic conductor (AMC), an antenna element, and a feed network comprised of shielded feedlines whose outer conductor, or shield, is routed through the substrate of the AMC. The feedline outer conductor is connected to both the substantially continuous conductive surface and the array of capacitive patches forming the AMC. The shielded feedline suppresses the excitation of undesired TM modes within the AMC substrate, results in a stable return loss over a frequency range associated with the AMC's high surface impedance and surface wave bandgap.

Abstract: A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

Abstract: Electromagnetic slow wave structures (SWS) comprised of arrays of conductive obstacles are formed inside conductive parallel-plate waveguides These SWS may be formed using, for example, MEMS manufacturing processes at the wafer level on substrates including ceramic and silicon. An effective relative permittivity in the range of 15 to 40 may be obtained at millimeterwave frequencies. The SWS can be made absorptive by incorporating resistive losses in a plate of the PPW. Applications of these slow wave structures include delay lines and bootlace lens beamformers for microwave and millimeterwave antenna systems.

Abstract: A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

Abstract: A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS). The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode. Examples of mode suppression structures are presented and analyzed by transverse resonance models. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

Abstract: A parallel plate waveguide structure configured to suppress parallel-plate waveguide modes is described. The electromagnetic material properties of individual layers disposed between the conductive plates of waveguide may be selected to allow an apparent stopband to form. Several physical examples of electromagnetic bandgap (EBG) structures are presented that are analyzed by full wave simulations and transverse resonance models.

Abstract: An electromagnetic reactive edge treatment including an array of capacitively-loaded loops is disposed at or near an edge of a conductive wedge. The axes of the loops are oriented parallel to the edge of the wedge. This edge treatment may enhance or suppress the hard diffraction coefficient, depending on the resonant frequency fo of the array of loaded loops. Diffraction of incident waves that are lower (higher) in frequency than fo may be enhanced (suppressed) due to the increase (decrease) in effective permeability of the volume occupied by the array of loops. Applications include controlling antenna patterns, side lobe levels, and backlobe levels for antennas mounted on conductive surfaces near edges or corners.

Abstract: Apparatus for suppressing noise and electromagnetic coupling in the printed circuit board of an electronic device includes an upper conductive plate and an array of conductive coplanar patches positioned a distance t2 from the upper conductive plate. The distance t2 is chosen to optimize capacitance between the conductive coplanar patches and the upper conductive plate for suppression of noise or electromagnetic coupling. The apparatus further includes a lower conductive plate a distance t1 from the array of conductive coplanar patches and conductive rods extending from respective patches to the lower conductive plate.

Abstract: An electromagnetic reactive edge treatment including an array of capacitively-loaded loops is disposed at or near an edge of a conductive wedge. The axes of the loops are oriented parallel to the edge of the wedge. This edge treatment may enhance or suppress the hard diffraction coefficient, depending on the resonant frequency fo of the array of loaded loops. Diffraction of incident waves that are lower (higher) in frequency than fo may be enhanced (suppressed) due to the increase (decrease) in effective permeability of the volume occupied by the array of loops. Applications include controlling antenna patterns, side lobe levels, and backlobe levels for antennas mounted on conductive surfaces near edges or corners.

Abstract: A bandpass radome is described including inductive layers comprising periodic conductive grids. First and second capacitive patch layers may be disposed above, and third and fourth capacitive patch layers may be disposed below the inductive layer to realize a 2-pole bandpass radome. An additional inductive layer and a fifth and sixth capacitive patch layers may be added below the fourth capacitive layer to realize a 3-pole bandpass radome. Conductive posts may connect one of the uppermost patch layers to one of the lowermost patch layers without connecting to the intervening inductive conductive grids. The conductive posts may form a rodded medium to suppress transverse magnetic (TM) surface waves. The total thickness of the bandpass radome may be less than 1/30 of a free-space wavelength at the center of a passband frequency. More than one passband may be separated by a ratio of center frequencies exceeding 1.5.

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Particular embodiments include clusters of small vias that effectively function as one large via, thereby increasing stop band bandwidth and maximizing parallel plate capacitance. Cluster vias can be configured to additionally provide a shielded and impedance matched route within the interior area of the cluster through which signal vias can connect transmission lines disposed in planes lying above and below the PPW. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract: Apparatus for suppressing noise and electromagnetic coupling in the printed circuit board of an electronic device includes an upper conductive plate and an array of conductive coplanar patches positioned a distance t2 from the upper conductive plate. The distance t2 is chosen to optimize capacitance between the conductive coplanar patches and the upper conductive plate for suppression of noise or electromagnetic coupling. The apparatus further includes a lower conductive plate a distance t1 from the array of conductive coplanar patches and conductive rods extending from respective patches to the lower conductive plate.

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Particular embodiments include clusters of small vias that effectively function as one large via, thereby increasing stop band bandwidth and maximizing parallel plate capacitance. Cluster vias can be configured to additionally provide a shielded and impedance matched route within the interior area of the cluster through which signal vias can connect transmission lines disposed in planes lying above and below the PPW. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.