Abstract: A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion metal, such as Invar, a 36% nickel—64% iron alloy. By orienting the metallic grains of the laminated metal layers to be off-set from the orientation of metallic grains of adjacent metallic foil layers, increased strength and flatness is achieved.

Abstract: An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of Invar®, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The Invar spacers may be composed of Invar foils adhered to one another in a laminated structure. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.

Abstract: A method of fabricating a plurality of micro probes comprising the steps of defining the shapes of a plurality of probes as a mask, applying a photoresist to a surface of a metal foil, overlaying the mask on the metal foil, exposing the photoresist to light passed through the mask, developing the photoresist, removing a portion of the photoresist to expose a portion of the metal foil, applying an etcher to the surface of the metal foil to remove the exposed portion to produce a plurality of probes, and chemically polishing and plating the plurality of probes.

Abstract: The device (1) picks up and aligns a sawframe (30) for handling and aligning silicon wafers (31). The device (1) includes at least one resiliently moveable locating arm (11) which is adapted to engage co-operably with a notch (35, 36) on the periphery of the sawframe (30) when the device (1) is moved into contact therewith. The sawframe (30) is thus urged into alignment with the device (1), and may be held in position relative to the device (1).

Abstract: A probe card assembly that compensates for differing rates of thermal expansion is disclosed herein. The assembly is comprised of a multi-layered dielectric plate interposed between a probe head and a printed circuit board. The printed circuit board has arrayed upon its surface a first plurality of electrical contacts arranged in a pattern. The dielectric plate has a second plurality of electrical contacts arranged in a pattern matching the first plurality of contacts. A planarizing interposer is interposed between the plate and the printed circuit board and has a pattern of holes matching the pattern of electrical contacts on the printed circuit board and plate. The assembly further includes a plurality of electrical connectors disposed within each of the holes arrayed in a pattern upon the planarizing interposer a plurality conductive bumps or fuzz buttons making electrical contact with the first and second plurality of electrical contacts.

Abstract: An improved vertical pin probing device is constructed using Invar, which substantially matches the coefficient of thermal expansion of the silicon wafer being probed. Spaced dies with Invar foils supporting the probe pins are coated with wear-resistant dielectric materials having lubricity to permit the probe pins to slide in the holes during probing.

Abstract: A universal design of a multiple layer printed circuit board incorporates a series of routing vias interconnecting the various layers. The routing vias are connected to conductive traces in the internal trace layers by internal junctions. The internal junctions are located on the via so that internal junctions may be selectively severed by means of a laser or high pressure water cutting system or other fine line cutting tool or mechanism to customize the circuit design for a particular semiconductor device or integrated circuit.

Abstract: An improved vertical pin probing device is constructed with a housing spaced upper and lower dies of Invar.RTM., which substantially matches the coefficient of thermal expansion of the silicon wafer being probed. Spaced slots in the top and bottom dies of the housing contain inserts of Vespel.RTM.. The inserts are provided with matching patterns of holes supporting probe pins and insulating the probe pins from the housing.

Abstract: An interconnection device used with test probe equipment for connecting a vertical-pin integrated circuit probing device to external test equipment. The interconnection device comprises a probe card with a pattern of contacts, a mounting plate adjustably mounted to the probe card and a space transformer member attached to both the mounting plate and the probe card. The space transformer carries traces which connect a small pattern of pins on the probing device with a larger pattern of conductors on the probe card. The space transformer is a laminated impedance-matching member comprising two layers of beryllium copper separated by a thin dielectric adhesive.

Abstract: A probe holder for a wafer probe station is comprised of a pair of over-and-under rigid extensions, one of which receives the probe shank and the other of which is connected to the probe to make a Kelvin connection. The two coaxial extensions are supported by a vertical tube which contains a pair of coaxial cables connected to triaxial cables outside of the probe station enclosure.

Abstract: A probe station has probe manipulators with probe supports disposed around a cover assembly with an inspection opening. Each probe support has a vertical tube extending through an opening in the cover assembly and a horizontal adjustable member extending radially inwardly and supporting a probe holder. Each such horizontal member may be angularly and longitudinally adjusted with respect to its vertical tube. Pairs of coaxial guarding cables run inside the vertical tubes and make Kelvin connections to the probe holders.

Abstract: An adapter for holding a silicon wafer in an inverted position of a probe station to allow backside emission testing is described. The wafer is positioned in a carrier having an opening therethrough for backside emission testing while the wafer is energized and probed beneath the carrier. A special probe card holder is provided with a self-leveling feature by means of a leveling frame on the probe card holder cooperating with the wafer carrier.

Abstract: A probe assembly for testing an integrated circuit includes a probe card of insulating material with a central opening, a rectangular frame with a smaller opening attached to the probe card, four separate probe wings each comprising a flexible laminated member having a conductive ground plane sheet, an adhesive dielectric film adhered to the ground plane, and probe wing traces of spring alloy copper on the dielectric film. Each probe wing has a cantilevered leaf spring portion extending into the central opening and terminates in a group of aligned individual probe fingers provided by respective terminating ends of said probe wing traces. The probe fingers have tips disposed substantially along a straight line and are spaced to correspond to the spacing of respective contact pads along the edge of an IC being tested. Four spring clamps each have a cantilevered portion which contact the leaf spring portion of a respective probe wing, so as to provide an adjustable restraint for one of the leaf spring portions.

Abstract: A probe assembly adapted to test an integrated circuit (IC) device whose contact pads are deployed in a predetermined pattern in a common plane. The assembly includes a film membrane having a planar dielectric contactor zone and an array of suspension wings radiating from this zone. The wings are clamped at their ends by a mounting ring surrounding a port in a printed circuit board which exposes the contactor zone suspended below the board to the IC device to be tested, the ring being secured to the board. Deployed in a matching pattern on the exposed face of the contactor zone and cantilevered therefrom to assume an angle with respect thereto are spring contact fingers that are extensions of traces running along the wings of the membrane to leads on the printed circuit board. These leads extend to respective test terminals on the board which are connectable to electronic instrumentation for conducting tests on the IC device.

Abstract: A test probe assembly for testing an integrated circuit (IC) device having contact pads deployed in a predetermined pattern in a common plane. The assembly includes a contactor formed by a flexible film of dielectric material having a rectangular planar central zone from whose corners extend radial slots to define suspension quadrants. Probe contacts formed on the undersurface of the central zone in a matching pattern are connected to probe terminals on the margins of the quadrants. The quadrants are marginally supported on corresponding branches of a mounting frame whereby the central zone sags below the frame which surrounds a central port in a printed circuit board, the port exposing the central zone to the IC device to be tested.

Abstract: A multi-level test probe assembly for checking an integrated circuit chip before terminal leads are applied to the contact pads thereof which are deployed on the chip on a common plane, some pads being inwardly displaced relative to other pads. The assembly includes a planar insulation card provided with a port and having a printed circuit thereon whose traces are connected to a plurality of test terminals connectable to external testing equipment. Surrounding the port and bonded to the card is a mounting ring of dielectric material having a flat face on which is supported a first radial array of fine wires lying in a horizontal plane, the trailing end of each wire being connected to a respective trace.

Abstract: A test probe assembly for checking an integrated circuit chip before terminal leads are applied to the contacts thereof which are deployed on the chip in a common plane. The assembly includes a planar insulation card provided with a port and having a printed circuit thereon whose traces are connected to a plurality of test terminals connectable to external testing equipment. Surrounding the port and bonded to the card is a mounting ring of dielectric material having a flat face on which is supported a radial array of fine wires lying in a horizontal plane. These are maintained in their assigned positions by a layer of dielectric material adherent to the face, the wires being embedded in the layer. The wires cantilever across the port and converge toward the central region thereof below which is disposed the chip to be tested, the tapered leading end of each wire being double bent to define a needle having a shank section and a tip section terminating in a tip which engages a respective contact on the chip.

Abstract: Probes for a probe card adapted to test integrated circuit patterns having contacts deployed thereon, the card including an opening providing access to a pattern and a ring of spaced conductive pads surrounding the opening. The probes are adapted to be anchored on selected pads of the card, each probe being constituted by a rigid, blade-like needle-holder having a deflectable needle extending therefrom to engage a respective contact in the pattern being tested.

Abstract: A fixture for assembling a probe card adapted to test integrated circuit patterns having contacts deployed thereon. The card includes an opening providing access to a pattern and a ring of spaced conductive pads surrounding the opening. Anchored on selected pads are blade-like needle-holders having needles extending therefrom to engage the contacts in the pattern being tested. The fixture is designed to facilitate attachment of each needle-holder blade to its pad on the card and to orient the blade before such attachment so that the needle point is precisely aligned with the related contact.