Patents Assigned to Wentworth Mold Ltd.
  • Patent number: 8070470
    Abstract: A mold assembly has two mold half shells each having an outer and inner wall for defining the shape of a container to be formed. Two mold half carriers each have an inner wall overlaying and spaced from a corresponding mold shell outer wall for supporting the shells in the assembly. At least one insulating pad is sandwiched between the inner wall and the corresponding outer wall and is secured to one of the inner wall and the outer wall. The pad supports the outer wall in non-contacting and buffering relation relative the carrier inner wall. Each pad may be secured in a recessed seat in the respective wall. Pads may be secured in recessed seats having a depth less than the thickness of the pad. Pads absorb mold operational forces to reduce wear, reduce conduction from shell to carrier and facilitate the use of different-sized shells with one carrier.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: December 6, 2011
    Assignee: Wentworth Mold Ltd.
    Inventors: Tar Tsau, Kyi San Kyi
  • Publication number: 20100203186
    Abstract: A mold assembly has two mold half shells each having an outer and inner wall for defining the shape of a container to be formed. Two mold half carriers each have an inner wall overlaying and spaced from a corresponding mold shell outer wall for supporting the shells in the assembly. At least one insulating pad is sandwiched between the inner wall and the corresponding outer wall and is secured to one of the inner wall and the outer wall. The pad supports the outer wall in non-contacting and buffering relation relative the carrier inner wall. Each pad may be secured in a recessed seat in the respective wall. Pads may be secured in recessed seats having a depth less than the thickness of the pad. Pads absorb mold operational forces to reduce wear, reduce conduction from shell to carrier and facilitate the use of different-sized shells with one carrier.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 12, 2010
    Applicant: WENTWORTH MOLD LTD.
    Inventors: Tar Tsau, Kyi San Kyi