Abstract: The present disclosure relates to apparatus, systems, and methods that address the migration of least significant in memory cells due to inter-cell interference (ICI). The disclosed embodiments include a control unit that is configured to characterize the vulnerability of memory cells to ICI, and appropriately encode data stored in the vulnerable memory cells to address ICI. This encoding scheme, referred to as “stuck-at” encoding scheme, can be separate from the generic error correcting code encoding. The stuck-at encoding scheme can decrease the bit error rate of flash memory devices.

Abstract: A storage device including a first storage unit including a first media of a first type, a second storage unit including a second media of a second type, and a controller. The controller initializes the storage device for a host by receiving an initialization query from the host, identifying, to the host, that the storage device comprises the second storage unit but not the first storage unit, receiving an indication from the host indicating that the host is compatible with the first storage unit, and identifying, to the host, that the storage device comprises the first storage unit and the second storage unit. The host initializes the storage device by initializing the second storage unit, transmitting the indication to the controller indicating that the host is compatible with the first storage unit, receiving the identification of the first storage unit from the controller, and initializing the first storage unit.

Abstract: A disk drive includes an opaque cover secured to a base, where the opaque cover has an opening. A see-through insert, which includes an electrically conductive material, is affixed to the opaque cover over the opening. The electrically conductive material may be a coating applied to the see-through insert which, in one embodiment is a polymer coating having a certain surface resistivity. Alternatively, the coating's ESD-dissipative properties may be due to the presence of sputtered gold, sputtered indium tin oxide or a metal film. The electrically conductive material may alternatively be embedded in the see-through insert.