Abstract: A single-ended Class-A amplifier includes an amplification component (e.g., a vacuum tube) having at least an output terminal, a reference terminal and a control terminal. The control terminal receives a time-varying input signal. The amplification component responds to the time-varying input signal to vary an output voltage on the output terminal and to vary a current flowing between the output terminal and the reference terminal. A load is AC-coupled to the output terminal. A steered current source has a voltage input coupled to the output terminal and has a steered current output coupled to the output terminal. The steered current source is configured to increase the steered current to provide current to the load when the output voltage on the output terminal of the amplification component increases and to decrease the steered current when the output voltage on the output terminal of the amplification component decreases.

Abstract: Line relay contacts (LR1.sub.1, LR1.sub.2) are protected from power surges appearing on a telephone line (L1) during connect or disconnect of a station set (S1) from the line, by operating a hold relay (HR1) to place a hold bridge (HB1) across the line (L1) before energizing the line relay (LR1) to connect or disconnect the station set.

Abstract: An electrical connector pin is formed from a unitary piece of strip so as to be in the shape of an elongated tubular member with terminal and contact sections at opposite ends, and with an unbonded seam extending between those sections. The terminal section has in it a scoop depression adapted to receive a lead and solder for bonding the lead to the pin, the wall portion which bounds the scoop being interposed between the scoop's interior and the seam to prevent solder in the scoop from reaching the seam and wicking therealong. The pin is adapted to be inserted into the insulating support member of a multi-pin connector, and the pin has forward and reverse motion stop tabs for locking the pin in place in such member. The contact and terminal sections of the pin are selectively coated with, respectively, a corrosion resistant layer and a solderability promoting layer.

Abstract: An ultrasonic technique for remotely inspecting a body is described. A transducer (14), capable of generating and detecting ultrasonic signals, is coupled to the body. An ultrasonic signal (A.sub.o) is launched by the transducer (14) into the body (e.g. 10, 11) and is reflected by any imperfection (e.g. 12) therein. The effects of variations of the transmission coefficient between the transducer and the body are substantially eliminated by intentionally cutting a predetermined calibration notch (22) into the body under test. The analysis of the reflected ultrasonic signals at the notch (22) and at any imperfection (e.g. 12) within the body gives an indication of the quality of the body independently of the transducer/body transmission coefficient.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A process of electrodepositing a metal from an organic phase containing a salt or complex of that metal includes the steps of creating a dispersion of the organic phase in a conducting aqueous electrolyte with which it is immiscible and electrodepositing the metal onto a cathode which is immersed in the organic phase or the dispersion.

Abstract: A laser beam (88) is raster scanned over the surface of a patterned semiconductor wafer (66) at an angle normal thereto. A plurality of detectors, radially spaced from the wafer (66) and substantially coplanar therewith detect light scattered from contaminating particulate thereon. The detected light is converted into a video signal that is forwarded to a video monitor (84) to display the particulate material while eliminating the patterned surface background.

Abstract: An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of uniform thickness occupies a gap between the surface of the seat and the device. Leads (31) and (33) extend at a shallow, acute angle from the device. A lead (32) is mounted to a support (28) extending from the substrate (18). Inner portions of the leads (31, 32, 33), the device (14) and portions of the substrate (18), are encased by an envelope (22), while outer portions (67) of the leads and a mounting tab (19) of the substrate extend from the envelope.

Abstract: A high-speed, high-resolution testing circuit for both analog and digital circuit packs is described. The testing circuit, which employs data compression techniques, comprises a shift register (22) having an overall length selectively variable under program control, and an arrangement (18) for combining incoming data signals with feedback signals out of predetermined stages of the shift register. The positions of the feedback taps of the variable length shift register are selectively variable under program control (24,26).

Abstract: A coating material is applied to drawn lightguide fiber in a manner which substantially prevents the inclusion of bubbles and which causes the fiber to be disposed substantially concentrically within the coating layer. The lightguide fiber is advanced through a continuum of coating material, which extends from a free surface of a reservoir and through two dies that are arranged in tandem, at a velocity which causes air to be entrained in the coating material. A pressure gradient is established between portions of the first die adjacent to its exit orifice. A first one of the dies communicates with the reservoir and the second die and further communicates at the interface of the dies with a pressurized supply of the coating material.

Abstract: A cable which is capable of being made in a large pair size and yet which has excellent mechanical properties that maintain its integrity notwithstanding extremes in temperature during installation and shipping as well as during the rigors of installation includes a sheath system having a corrugated steel outer shield that is adhesively bonded to a plastic jacket. The corrugated steel shield which is formed to have a longitudinal overlapped seam that is preferably unsealed encloses an aluminum inner shield that in turn encloses a multiconductor core. Advantageously, the sheath system includes a plastic jacketing material which is capable of resisting biaxial stresses which are aggravated in a bonded sheath system. This results in jacket integrity about the longitudinal seam of the outer shield notwithstanding a notched cross-section and an unsupported bridged portion of the plastic jacket adjacent to the seam.

Abstract: A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles.

Abstract: A tool (10) for handling a magnetic article (50) includes a member (12) having a jaw (18) which is movable toward and away from a member (14) having a corresponding jaw (14). A holder (34) is associated with jaw (20) of member (14) for releasably holding an article (50) in cooperation with a magnetic field. A magnet (42) is associated with and removably applied by jaw (18) of member (12) in stages. To pick up an article (50), magnet (42) is moved by member (12) to establish a magnetic field at holder (34). To release an article (50), magnet (42) is withdrawn by member (12) to withdraw the magnetic field from holder (34). The article (50) is restrained at holder (34) until gravitational force overcomes the attraction of the withdrawing field and the article separates from tool (10).

Abstract: The formation of dross in a molten solder bath (28) by surface agitation of the bath, and the adverse effects of dross on a solder pumping operation, are essentially eliminated by suspending a pump shaft (36) and an impeller (38) thereon for free rotation within a housing (96) in the molten solder bath so that solder in the solder bath is precluded from making any significant contact with the rotating shaft. To insure against binding between the impeller (38) and an opposed horizontal inner surface (132) of the housing (96), a small amount of solder is permitted to flow continuously between the impeller and the surface into contact with the rotating shaft (36) adjacent the impeller. The small solder flow then is exposed to the atmosphere to form a correspondingly small amount of light powdery solder dross (134).

Abstract: The cost and energy efficiency of a power supply are optimized in a semi-regulated circuit wherein regulation occurs only under a high voltage, low current condition when peak output voltage would otherwise exceed a maximum specified voltage. The circuit includes a full wave rectifier (21-24) driving a modified pi filter (33-35). A transistor (62) in series with the filter is biased by a resistor (65) to normally operate in a fully saturated, low power dissipating mode. When the output (31-32) voltage approaches the specified maximum, the breakdown voltage of a zener diode (71) is exceeded, and the output voltage is clamped to the specified maximum through the zener diode and the base-emitter junction of the transistor.

Abstract: A number of remotely located locked devices (26 and 27) are selectively operated by sending signals from a central supervisory location (28) through the telephone network (27) to a telephone set 32 and a converter (44) installed at each remote location. Initiating call signals from a remote telephone set are automatically generated and routed through the telephone network to a supervisory telephone set equipped with a standard 0-9 digit dial plus a special pushbutton (34) for generating a special signal. Receipt of the special signal at a calling remote station disconnects the remote telephone set and conditions a stepping circuit (74-86) and a sequence circuit (81-82) for subsequent operation upon receipt (88-104) of a predetermined sequence of 0-9 digit signals. Upon receipt of the predetermined sequence of signals within a first set time period, the stepping circuits and the sequence circuits are operated to generate (111) a signal that releases the locked device for a second set time period.

Abstract: An assembly is provided for selecting at least one vertically oriented planate article such as a disc-shaped wafer (10) from an array of such wafers. A carrier (20) holds the wafers (10) in a mutually spaced, substantially parallel relationship along a single horizontal file. Peripheral portions of each wafer (10) are supported in opposing guides (26) formed generally vertically along opposing first and second sidewalls (22) and (24), respectively, of the carrier (20). A frame (42) positions the carrier (20) so the file of wafers (10) extends substantially along a vertical plane (44) passing generally centrally of each wafer and of the frame (32). A rotatable shaft (62) extends parallel to the file and subjacent of the wafers (10). For selecting a singular wafer (10), at least one cam (64) is mounted to and rotates with the shaft (62) for engaging and displacing a randomly selected wafer (10) a desired distance upwardly along the guides (26) of the carrier (20).