Abstract: A method for removing lead and other basic impurities from copper during refining of the copper comprises treating molten copper to be refined with a slag having a final composition including iron oxide, calculated as Fe.sub.2 O.sub.3 and silica (SiO.sub.2) wherein the weight ratio of iron oxide to silica is from 0.4 to 0.8. The novel slag preferably contains less than 10% boric oxide and up to 30% phosphorus pentoxide.

Abstract: A method of stabilizing a mixture of an organopolysiloxane and an organo-metallic curing catalyst against gelation comprises adding a sufficient amount of methanol to the catalyst to deactivate the catalyst prior to adding the catalyst to the polysiloxane.

Abstract: Tin and antimony impurities can be removed from copper scrap by melting the scrap in the presence of a flux comprising a mixture of calcium and solution oxides in a weight ratio of calcium oxide to sodium oxide of from 1:1 to 4:1.

Abstract: A method of depositing a uniform dielectric film on a silicon substrate comprising flowing a plasma comprising an RF-excited mixture of an inert gas such as argon and silane over the substrate to form a film of porous a-Si.sub.x H.sub.y over the surface of the substrate. The flow of plasma is then discontinued and a flow of a nitrogen or oxygen plasma is substituted therefor. The temperature of the substrate is increased to at least 360.degree. C. to diffuse-out hydrogen from the Si.sub.x H.sub.y film on the substrate, each departing hydrogen atom leaving a dangling Si bond behind which combines with the activated oxygen or nitrogen thereby to form the desired dielectric film of formula Si.sub.x N.sub.y or Si.sub.x O.sub.y.

Abstract: In the assembly of a plurality of connectors with a supporting back plate, the plate is positioned to permit movement of a plurality of connector-receiving nests through openings in the plate. The connectors are then fed from a supply and into a diverging track system to space the connectors in alignment with and to feed them into the nests. The nests are then moved through the plate opening to deposit extended end portions of the connectors onto the plate adjacent to bendable clasps formed integrally with the plate. The clasps are then bent to secure the connectors with the plate.