Abstract: The RFID tag applicable to metallic environment, is fitted with a dielectric substrate adhered to conducting antenna. And, a wireless telecommunication IC is linked to antenna, which is provided with a radiator and a grounding terminal. The radiator is mounted onto the surface of dielectric substrate, and the grounding terminal is mounted onto the back of dielectric substrate. The entire antenna unit is available with a resonant mode or radiation mechanism, whereas a wireless telecommunication IC is electrically linked between radiator and grounding terminal. This complete structure of RFID tag enables correct read/write of reader/writer for use with metallic products.

Abstract: The antenna module fabrication for a wireless electronic device includes setting up the antenna and the assembly base that is to connect the antenna to the designated circuit board. The antenna and the assembly base are two independent pieces, and the positioning parts are for positioning so that the antenna and assembly base are one body. The antenna module of the invention can achieve the advantages such as simple production, cost effectiveness, prevention of the antenna module from deforming and quality improvement.

Abstract: A metal bumping structure on the input/output connector of a substrate or wafer, which is a metal conductor composed of multiple metal layers overlap the connector pad, characterized in that the overlapped outer or upper metal layer is thinner than the inner or lower metal layer, and the outer or upper metal layer that form the pillar style whose conductivity, connectivity and corrosion resist are better than the inner or lower metal layer, such that the bumping connector has better conductivity, connectivity and not easy to be corroded. It combines the photoresist, exposure, development with the electroless plating method to form the patterns and shapes of the expected object; wherein, the photoresist is to limit the deposition direction of the electroless, plating. If no limit on the electroless plating, it will cause isotropic deposition, as to simultaneously strive upward and around increasing; thus the photoresist is to assist with the electroless plating to form expected patterns and shapes.