Abstract: A single package arrangement is provided. The arrangement includes a set of electronic components. The arrangement also includes a set of input/output (I/O) cells, which is encapsulated within the set of electronic components. The arrangement further includes a set of electrostatic discharge (ESD) arrangements. Each ESD arrangement of the set of ESD arrangements is configured for at least coupling with an I/O cell of the set of I/O cells and protecting the I/O cell from the electrostatic discharge using a set of ESD constructs. The set of ESD constructs includes at most two non-configurable ESD constructs to protect the I/O cell from the electrostatic discharge.

Abstract: A multiple integrated circuit arrangement within a single package is provided. The multiple integrated circuit arrangement includes a set of electronic components, which includes at least a set of dies. The first die of the set of dies is coupled to a first electronic component of the set of electronic components, wherein the first electronic component is not the first die. The arrangement includes a built-in-self-test (BIST) arrangement, which is at least partly encapsulated within the single package, wherein the BIST arrangement is configured for at least testing the first die of the set of dies. The arrangement also includes a built-in-self-repair (BISR) arrangement, which is at least partly encapsulated within the single package, wherein the BISR arrangement is configured for at least repairing the multiple integrated circuit arrangement.

Abstract: A multiple integrated circuit arrangement within a single package is provided. The arrangement includes a set of dies, which is encapsulated within the single package. The arrangement also includes a built-in-self-test (BIST) arrangement, which is at least partly encapsulated within the single package. The BIST arrangement is configured for at least performing a test on at least a first die of the set of dies.