Patents Assigned to WID GROUP
  • Patent number: 11023693
    Abstract: The invention relates to a bottle case management system, each bottle being provided with an electronic chip, the management system comprising: a first frame (160) having a first shape, a second frame (162) having a second form, the second shape being complementary to the first shape, the assembly of the two frames (160, 162) forming a framework delimiting an internal opening intended for the insertion of a conveyor (58) on which cases (12) run in a running direction (X), the internal opening having a dimension along a direction orthogonal to the running direction between 300 mm and 1000 mm, at least one chip reader being comprised in the frame.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: June 1, 2021
    Assignee: WID GROUP
    Inventors: Alexandre Mongrenier, Benoît Sudre
  • Patent number: 10963769
    Abstract: A label is applied to a barrel containing liquid. The label includes an electronic chip, which includes a first layer as a support layer, a second layer as an electronic chip layer, and a third layer as a customization layer. The electronic chip layer includes at least an electronic chip and an antenna connected to the electronic chip. The customization layer includes at least one metal sublayer made of a metal material. Each of the layers has two faces, and the three layers are placed one above the other in a stacking direction. The thickness of the metal sublayer along the stacking direction is less than or equal to 35 ?m.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: March 30, 2021
    Assignee: WID Group
    Inventors: Alexandre Mongrenier, Benoît Sudre
  • Patent number: 10719753
    Abstract: The invention relates to a label comprising an electronic chip for applying to a bottle of liquid, said label comprising; a first layer (S), called a support layer (S), a second layer (E), called an electronic chip layer (E), comprising at least an electronic chip and an antenna connected to the electronic chip, and a third layer (P), called customization layer (P), in which each layer (S, E, P) has two faces, and the three layers (S, E, P) are placed one above the other in a stacking direction, and in which the customization layer (P) comprises at least one sublayer (C5), called metal sublayer (C5), made of a metal material, the thickness of the metal sublayer (C5) along the stacking direction being less than or equal to 35 ?m.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: July 21, 2020
    Assignee: WID GROUP
    Inventors: Alexandre Mongrenier, Benoit Sudre