Patents Assigned to Will Be S & T Co., Ltd.
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Patent number: 9827647Abstract: A retainer ring for a chemical-mechanical polishing device. The ring prevents damage that occur during polishing work and being usable in stable fashion up until a predetermined lifespan has elapsed, by ensuring that a first ring body mounted on the chemical-mechanical polishing device and a second ring body making contact with a polishing pad are firmly coupled together by means of securing bodies which pass through coupling holes in the first ring body and are coupled to recessed coupling parts in the second ring body, and also by means of adhesive parts which are provided in the coupling holes or the recessed coupling parts and adhere and secure the securing bodies.Type: GrantFiled: July 10, 2014Date of Patent: November 28, 2017Assignee: WILL BE S & T CO., LTD.Inventors: Jae-Bok Lee, Jun-Je Lee
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Patent number: 9005499Abstract: Disclosed herein is a method of manufacturing a retainer ring for a chemical mechanical polishing device. Insert pins are coupled to an insert ring member. The insert ring member is thereafter disposed in a mold such that a space is defined around the insert ring member in the mold. Subsequently, molten shell material is injected into the mold to form a shell member. Thereby, the retainer ring is manufactured, having a structure such that the insert ring member is completely covered with the shell member.Type: GrantFiled: February 22, 2011Date of Patent: April 14, 2015Assignee: Will Be S & T Co., Ltd.Inventors: Han-Ju Lee, Min-Gyu Kim, Kwang-Hee Ku, Jae-Bok Lee
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Publication number: 20120319321Abstract: Disclosed herein is a method of manufacturing a retainer ring for a chemical mechanical polishing device. Insert pins are coupled to an insert ring member. The insert ring member is thereafter disposed in a mold such that a space is defined around the insert ring member in the mold. Subsequently, molten shell material is injected into the mold to form a shell member. Thereby, the retainer ring is manufactured, having a structure such that the insert ring member is completely covered with the shell member.Type: ApplicationFiled: February 22, 2011Publication date: December 20, 2012Applicant: Will Be S & T Co., Ltd.Inventors: Han-Ju Lee, Min-Gyu Kim, Kwang-Hee Ku, Jae-Bok Lee
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Patent number: 7622016Abstract: A retainer ring of a chemical-mechanical polishing device which can prevent itself from being twisted and improve defective proportion and equipment operating rate occurred when polishing semiconductor wafers by embedding a metal member inside. Retainer ring installed to a polishing head of a chemical mechanical polishing device to fix a semiconductor wafer includes: a first member of a resin connected to a carrier of the polishing head and a room is formed inside; a second member of a metal embedded into the room of the first member. The present invention can improve a defective proportion of a semiconductor wafer polishing process by above effects and can reduce initial limitation conditions accompanied to mass production to increase an equipment operation rate by providing credibility of the retaining ring.Type: GrantFiled: June 16, 2006Date of Patent: November 24, 2009Assignee: Will Be S & T Co., Ltd.Inventor: Han-Ju Lee
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Patent number: 6505634Abstract: The object of this invention is to provide a semiconductor wafer cleaning apparatus designed to clean several wafers at the same time while rotating the wafers held in a horizontal, laid-down position. In an operation of this apparatus, a wafer feeding robot arm 20 feeds wafers 60 from a wafer cassette 10 to a wafer boat 50 and seats the wafers in the wafer boat while maintaining a horizontal, laid-down position of the wafers. The wafer boat 50, with the horizontally laid-down wafers 60, is vertically moved downward by a boat drive unit 40 to be immersed in a wafer cleaning liquid flowing in a wafer cleaning bath 30. Thereafter, the boat 50 is rotated within the wafer cleaning liquid, and so the wafers 60 are washed and cleaned by the wafer cleaning liquid while being maintained in the horizontal, laid-down position and being rotated horizontally.Type: GrantFiled: March 23, 2001Date of Patent: January 14, 2003Assignee: Will Be S & T Co., Ltd.Inventors: So-Lip Son, Han-Joo Lee
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Publication number: 20020134410Abstract: The object of this invention is to provide a semiconductor wafer cleaning apparatus designed to clean several ten wafers at the same time while rotating the wafers held in a horizontal, laid-down position. In an operation of this apparatus, a wafer feeding robot arm 20 feeds wafers 60 from a wafer cassette 10 to a wafer boat 50 and seats the wafers in the wafer boat while maintaining a horizontal, laid-down position of the wafers. The wafer boat 50, with the horizontally laid-down wafers 60, is vertically moved downward by a boat drive unit 40 to be immersed in a wafer cleaning liquid flowing in a wafer cleaning bath 30. Thereafter, the boat 50 is rotated within the wafer cleaning liquid, and so the wafers 60 are washed and cleaned by the wafer cleaning liquid while being maintained in the horizontal, laid-down position and being rotated horizontally.Type: ApplicationFiled: March 23, 2001Publication date: September 26, 2002Applicant: Will Be S & T Co., Ltd.Inventors: So-Lip Son, Han-Joo Lee