Patents Assigned to Willard Industries, Inc.
  • Patent number: 4806309
    Abstract: A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver.
    Type: Grant
    Filed: January 5, 1988
    Date of Patent: February 21, 1989
    Assignee: Willard Industries, Inc.
    Inventor: Stanley Tulman
  • Patent number: D329324
    Type: Grant
    Filed: June 25, 1990
    Date of Patent: September 15, 1992
    Assignee: Willard Industries, Inc.
    Inventor: Pamela Stokely