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Patents
Patents Assigned to Willard Industries, Inc.
Patents Assigned to Willard Industries, Inc.
Tin base lead-free solder composition containing bismuth, silver and antimony
Patent number:
4806309
Abstract:
A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver.
Type:
Grant
Filed:
January 5, 1988
Date of Patent:
February 21, 1989
Assignee:
Willard Industries, Inc.
Inventor:
Stanley Tulman
Sock
Patent number:
D329324
Type:
Grant
Filed:
June 25, 1990
Date of Patent:
September 15, 1992
Assignee:
Willard Industries, Inc.
Inventor:
Pamela Stokely