Abstract: A compliant chuck has a top base assembly, a bottom bracket assembly, a contact plate, a sensor device, a thermoelectric cooling module and a heat-dissipating module. The bottom bracket assembly has a center opening. The contact plate is disposed between the top base assembly and the bottom bracket assembly and has a protrusion corresponding to the center opening and having a mounting hole and an adsorbing hole. The sensor device is mounted in the mounting hole. The thermoelectric cooling module is attached to a top surface of the contact plate. The heat-dissipating module is mounted on the thermoelectric cooling module and cooperates with a chiller to dissipate heat. The compliant chuck uses the sensor device to sense surface temperature of a semiconducting device during testing the semiconducting device so as to compensate the temperature by controlling current into the thermoelectric cooling module.