Abstract: This invention relates to a join-structure of high-density connector and interface module comprising a dielectric housing unit, a plurality of terminals, an interface card, a retention mechanism, and a motherboard, wherein the join-structure includes a lateral contact and a plate contact type. In the lateral contact type, terminals in upper layer and lower layer are punched and aligned in a single material feeding band in staggered arrangement, and the terminals in the material feeding band can be folded at connection strips to stand in two rows. As to plate contact type, two-layer terminals are cross-inserted to fixing roots, which are designed in two-section manner and supported at two turning points with enhancing protruded strips. The terminals are plugged and fixed in reception grooves of the dielectric housing unit.