Abstract: A USB device is coupled to a first USB communication line and a second USB communication line. Separate first and second paths are created between an external device and a controller in the USB device, with both paths including the first and second USB communication lines. The USB device detects whether a USB connection exists over the first and second USB communication lines. If a USB connection exists over the first and second USB communication lines, USB communication is routed via the first path. Otherwise, testing communication is routed via the second path. The external device can be either a USB host or a testing unit.

Abstract: A process for fabricating a sub-micron or deep sub-micron semiconductor device on a wafer surface with an improved anti-reflective coating is disclosed. It includes the steps of: (a) depositing an aluminum layer on a wafer surface; (b) depositing an inorganic anti-reflective layer TiN on top of the aluminum layer; (c) depositing a dielectric partitioning layer, typically a polymer layer, on top of the TiN layer; (d) depositing an organic anti-reflective layer on the dielectric partitioning layer; (e) depositing a photoresist on the organic anti-reflective layer; (f) performing a photolithography process to form a photoresist pattern using a deep UV technology in conjunction with a photomask; (g) removing the organic anti-reflective the and the dielectric partitioning layer not covered by the photoresist using an oxide etcher; and (h) removing the TiN layer and the metal layer also not covered by the photoresist using a metal etcher.