Abstract: A memory device is provided, including a built-in self-test circuit and a redundancy address replacement circuit. The built-in self-test circuit coupled to a main memory cell array is configured to performing a built-in self-test process on the main memory cell array so as to provide a built-in self-test signal. The redundancy address replacement circuit includes a first redundancy circuit and a second redundancy circuit. The first redundancy circuit replaces portion of word line addresses of the main memory cell array with that of a redundancy memory block according to first redundancy data signals generated by a first test process. The second redundancy circuit, coupled to the first redundancy circuit, replaces the failure word line addresses detected in the main memory cell array with another portion of word line addresses of the redundancy memory block according to the built-in self-test signal.

Abstract: A memory device and a data reading method are provided. A dummy circuit performs a read operation in synchronism with a data access circuit according to an address signal, so as to estimate time points at which the data access circuit completes each of operating procedures, and enable the data access circuit to execute a next operating procedure when completing an operating procedure.

Abstract: A package substrate including a carrier, a first patterned conductive layer, a second patterned conductive layer and a 3D-printing conductive wire is provided. The carrier has a first surface, a second surface and a third surface. The first surface is opposite to the second surface, and the third surface is connected between the first surface and the second surface. The first patterned conductive layer is disposed on the first surface. The second patterned conductive layer is disposed on the second surface. The 3D-printing conductive wire is disposed on the third surface and connected between the first patterned conductive layer and the second patterned conductive layer.

Abstract: The invention provides a flash memory which may effectively protect information with a high security level. A flash memory includes a setting part. When the setting part is inputted a specific command, the setting part sets up specific address information to a nonvolatile configuration register, and sets up specific data in a hidden storage region. The flash memory also includes: a comparing part, which compares inputted address information and the specific address information during a reading operation; and a control part, which reads specific data set in the storage region and erases a specific address when two address information are consistent, and reads data stored in a memory array according to the inputted address information when two address information are inconsistent.

Abstract: A non-volatile semiconductor memory device is provided. A determination circuit 200 used to determine the suspected qualification is connected with a plurality of page buffer/sensing circuits 170 via wirings PB_UP, PB_MG, PB_DIS. The page buffer/sensing circuit 170 includes a transistor Q2 in which a reference current Iref flows through a transistor Q1 when the programming verification is unqualified. The determination circuit 200 includes a comparator CMP, a voltage of the wiring PB_UP is supplied to one of input terminals of the comparator CMP, and a reference voltage Vref is supplied to another one of the input terminals. The reference voltage Vref is generated by a reference current (Iref*N) whose amount is corresponding to an unqualified bit number (N) which is determined to be suspectedly qualified.

Abstract: A method of fabricating a memory is provided. A substrate including a memory region and a periphery region is provided. A plurality of first gates is formed in the memory region and a plurality of first openings is formed between the first gates. A nitride layer is formed on the substrate in the memory region, and the nitride layer covers the first gates and the first openings. An oxide layer is formed on the substrate in the periphery region. A nitridization process is performed to nitridize the oxide layer into a nitridized oxide layer. A conductive layer is formed on the substrate, and the conductive layer includes a cover layer disposed on the substrate in the memory region and a plurality of second gates disposed on the substrate in the periphery region. The cover layer covers the nitride layer and fills the first openings.

Abstract: A brush comprises a sleeve, a cap member, a brushing member, and at least one elastic member. The sleeve has a first end and a second end. The brushing member is movably received in the sleeve at the first end, while the cap member is firmly coupled to the sleeve at the second end. The elastic member is disposed between the cap member and the brushing member so that a portion of the brushing member protrudes from the first end of the sleeve.