Patents Assigned to Winchester Electronics
  • Patent number: 7484998
    Abstract: The present invention provides an apparatus and method for connecting an array of cables (e.g., coaxial cables) to a circuit board (e.g., the surface of the circuit board).
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: February 3, 2009
    Assignee: Winchester Electronics Corporation
    Inventor: John E. Benham
  • Patent number: 7351114
    Abstract: The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: April 1, 2008
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, Kenny Padro, Robert D. Godburn, Jr.
  • Patent number: 7329139
    Abstract: The present invention, in one aspect, provides a connector apparatus that can be used in, among other things, applications requiring RF or high-speed digital electrical signals.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: February 12, 2008
    Assignee: Winchester Electronics Corporation
    Inventor: John E. Benham
  • Patent number: 7322846
    Abstract: The invention relates to a connector that can be easily mated to a jack connector.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: January 29, 2008
    Assignee: Winchester Electronics Corporation
    Inventor: David J. Camelio
  • Patent number: 7264485
    Abstract: The present invention relates to electrical connectors, and, in particular, to power connectors and to improved contact structures and methods related thereto.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: September 4, 2007
    Assignee: Winchester Electronics Corporation
    Inventors: Robert D. Larsen, Lee M. Drozdenko
  • Publication number: 20070173100
    Abstract: The present invention, in one aspect, provides a connector apparatus that can be used in, among other things, applications requiring RF or high-speed digital electrical signals.
    Type: Application
    Filed: February 26, 2007
    Publication date: July 26, 2007
    Applicant: Winchester Electronics Corporation
    Inventor: John Benham
  • Patent number: 7228628
    Abstract: In one aspect, the invention provides a method for making an electrical connector. The method may include: obtaining a part having a first end portion, a second end portion, and an interim 1 portion between the first and second end portions; flattening the second end portion; trimming the flattened second end portion; and forming a hole in the flattened second end portion.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: June 12, 2007
    Assignee: Winchester Electronics Corporation
    Inventors: Lee A. Wolfel, Robert Larsen, Robert D. Godburn, Jr.
  • Publication number: 20070105417
    Abstract: The invention relates to a connector that can be easily mated to a jack connector.
    Type: Application
    Filed: November 1, 2006
    Publication date: May 10, 2007
    Applicant: Winchester Electronics Corporation
    Inventor: David Camelio
  • Patent number: 7189097
    Abstract: The present invention, in one aspect, provides a connector apparatus that can be used in, among other things, applications requiring RF or high-speed digital electrical signals.
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: March 13, 2007
    Assignee: Winchester Electronics Corporation
    Inventor: John E. Benham
  • Patent number: 7160122
    Abstract: The present invention relates to electrical connectors, and, in particular, to power connectors and to improved contact structures and methods related thereto.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: January 9, 2007
    Assignee: Winchester Electronics Corporation
    Inventors: Robert D. Larsen, Lee M. Drozdenko
  • Publication number: 20070004252
    Abstract: The present invention relates to electrical connectors, and, in particular, to power connectors and to improved contact structures and methods related thereto.
    Type: Application
    Filed: September 7, 2006
    Publication date: January 4, 2007
    Applicant: Winchester Electronics Corporation
    Inventors: Robert Larsen, Lee Drozdenko
  • Publication number: 20060292932
    Abstract: The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.
    Type: Application
    Filed: September 1, 2006
    Publication date: December 28, 2006
    Applicant: Winchester Electronics Corporation
    Inventors: John Benham, Kenny Padro, Robert Godburn
  • Patent number: 7101191
    Abstract: The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: September 5, 2006
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, Kenny Padro, Robert D. Godburn, Jr.
  • Patent number: 4834662
    Abstract: The method and the arrangement for the connection of a multipole connector to a circuit board (1), specifies that the circuit board (1) is provided with a plurality of blind holes (3), equivalent in number to and matching the location of terminals (4) extending out of the connector housing (2). The blind holes (3) are filled with solder paste (5) and the mechanical and electrical connection of the connector (2) with the circuit board (1) is carried out by reflowing the solder paste. Compared with the conventional technique utilizing through-drilled connection holes, the invention provides the advantage that conductor paths can be routed underneath the blind holes, soldering paste cannot get on the underside of the circuit board, and a tolerance compensation of the lengths of the terminals is insured without subjecting the circuit board to preload forces exerted by the terminals.
    Type: Grant
    Filed: February 22, 1988
    Date of Patent: May 30, 1989
    Assignee: Winchester Electronics, Subsidiary of Litton Precision Products International GmbH
    Inventors: Otto Schempp, Werner Grunow
  • Patent number: 4806103
    Abstract: A high density edgecard connector system includes a first row of cantilever contacts and a second row of cantilever contacts which are longer than those of the first row. The edgecard includes first and second rows of contact pads which are located differing distances from the bottom of the edgecard. Ribs are mounted on the edgecard between each of the contact pads in the first row and lift the cantilever contacts of the second row away from the surface of the edgecard in order to prevent cross connections between the cantilever contacts of the second row and the contact pads of the first row during insertion or withdrawal of the edgecard into or out of the connector. The ribs include ramps on either end and may be integrally molded with a spine which attaches to the bottom edge of the edgecard.
    Type: Grant
    Filed: February 29, 1988
    Date of Patent: February 21, 1989
    Assignee: Winchester Electronics
    Inventors: Wolfgang Kniese, Otto Schempp