Patents Assigned to WinMEMS Technologies Co., Ltd.
  • Patent number: 11499966
    Abstract: A digitally encoded microflake includes a polymer layer, which has a top surface and a bottom surface substantially parallel to the top surface. At least one of the top surface and the bottom surface is to be coupled to target-specific probes for bonding with a target analyte. The microflake is identified by a binary sequence of bits encoded by an edge outline on a plane substantially parallel to the top surface and the bottom surface. The bits in the binary sequence are encoded at respective predefined locations surrounding the edge outline.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: November 15, 2022
    Assignee: WinMEMS Technologies Co., Ltd.
    Inventors: Chih-Hsiang Lai, Wen-Ching Lai
  • Patent number: 11366109
    Abstract: A digitally encoded microflake includes a polymer layer, which has a top surface and a bottom surface substantially parallel to the top surface. At least one of the top surface and the bottom surface is to be coupled to target-specific probes for bonding with a target analyte. The microflake is identified by a binary sequence of bits encoded by an edge outline on a plane substantially parallel to the top surface and the bottom surface. The bits in the binary sequence are encoded at respective predefined locations surrounding the edge outline.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: June 21, 2022
    Assignee: WinMEMS Technologies Co., Ltd.
    Inventors: Chih-Hsiang Lai, Wen-Ching Lai
  • Patent number: 7811849
    Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines the position of a MEMS part to be placed on the application platform. The method further comprises placing the MEMS part into the opening of the guiding mask on the application platform, and removing the guiding mask from the application platform after the MEMS part is bonded to the application platform.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: October 12, 2010
    Assignee: WinMEMS Technologies Co., Ltd.
    Inventor: Tseng-Yang Hsu