Abstract: A laser processing apparatus and a laser processing method for improving the processing speed and forming uniform and highly accurate through holes when processing for forming fine through holes in a matrix in a long thin plate, and a thin plate having through holes in a matrix formed by such laser processing. A laser processing apparatus includes a cylindrical body having an opening on a circumferential surface around which a thin plate to be processed is wound obliquely, a thin plate transfer for transferring a thin plate wound around the cylindrical body in the longitudinal direction of the thin plate, a motor having a rotation axis arranged coaxially with a central axis of the cylindrical body, a reflecting member fixed to a rotating shaft of the motor, a laser light emitting means for emitting pulsed light. The apparatus continuously opens through holes in the thin plate.

Abstract: A laser processing apparatus and a laser processing method for improving the processing speed and forming uniform and highly accurate through holes when processing for forming fine through holes in a matrix in a long thin plate, and a thin plate having through holes in a matrix formed by such laser processing. A laser processing apparatus includes a cylindrical body having an opening on a circumferential surface around which a thin plate to be processed is wound obliquely, a thin plate transfer for transferring a thin plate wound around the cylindrical body in the longitudinal direction of the thin plate, a motor having a rotation axis arranged coaxially with a central axis of the cylindrical body, a reflecting member fixed to a rotating shaft of the motor, a laser light emitting means for emitting pulsed light. The apparatus continuously opens through holes in the thin plate.