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Patents Assigned to WISE ET AL

IMPROVED METHODS AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) OF A SEMICONDUCTOR WAFER

Publication number: 20010046831

Abstract: Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.

Type: Application

Filed: June 14, 1999

Publication date: November 29, 2001

Applicant: WISE ET AL

Inventors: MICHAEL LESTER WISE, JEREMY KASPAT STEPHENS, SURI G. HEDGE