Abstract: A resonator includes: interdigital transducer (IDT) including first electrode including first base on piezoelectric substrate and extended in reference direction, and first protrusions connected to the first base and extended in direction intersecting with the reference direction, and second electrode including second base on the piezoelectric substrate and extended in the reference direction, and second protrusions connected to the second base and extended in direction intersecting with the reference direction, each of the second protrusions extended to have one of the first protrusions inserted between the second protrusion and another second protrusion adjacent to the second protrusion, wherein a width of each of first specific protrusions included between one end of the IDT and first position at first distance from the one end, among the first protrusions and the second protrusions, decreases from first specific protrusion closest to the first position toward first specific protrusion closest to the one e

Abstract: A method for manufacturing a film bulk acoustic resonator (FBAR) package with a thin film sealing structure includes: forming an FBAR having a bottom electrode, a piezoelectric layer, and a top electrode on a substrate; forming a plurality of inner pad electrodes electrically connected to the top electrode and the bottom electrode of the FBAR; attaching a PR (photo-resist) film to tops of the inner pad electrodes; etching the PR film to expose the inner pad electrodes to the outside; and forming a sealing layer on top of the PR film and tops of the exposed inner pad electrodes.

Abstract: A double mode SAW (DMS) filter includes: a plurality of interdigital transducers (IDTs), each having a plurality of Type 1 electrode fingers and a plurality of Type 2 electrode fingers formed on a piezoelectric substrate, wherein one Type 2 electrode finger among the plurality of Type 2 electrode fingers is disposed between two adjacent Type 1 electrode fingers among the plurality of Type 1 electrode fingers, and in a first IDT and a second IDT included in the plurality of IDTs to be adjacent to each other, one Type 1 electrode finger of the second IDT is disposed between two Type 1 electrode fingers of the first IDT. Accordingly, it is possible to provide a DMS filter capable of improving the amount of attenuation in an attenuation band adjacent to the wide band side for the passband and miniaturizing a product by saving space.

Abstract: A film bulk acoustic resonator (FBAR) chip and package structure with an improved temperature coefficient that is capable of being more stable with respect to surrounding temperature changes, without any decrease in performance of Q factor or k2e. The FBAR chip and package structure includes a plurality of FBARs located on a central area of one surface of a substrate and each having a bottom electrode, a piezoelectric material, and a top electrode; and a temperature compensation layer formed around the central area of one surface of the substrate.

Abstract: A resonator includes an interdigital transducer provided with a main electrode area formed to a shape of a comb on a piezoelectric substrate by a reference pitch in such a manner as to have a unit length along a longitudinal direction thereof and one pair of first electrode areas constituted of one side first electrode area formed to a shape of a comb on the piezoelectric substrate by a first increment pitch obtained by increasing the reference pitch by a first value in such a manner as to have the unit length along the longitudinal direction and the other side first electrode area formed to a shape of a comb on the piezoelectric substrate by a first decrement pitch obtained by decreasing the reference pitch by almost the same value as the first value.

Abstract: An air-gap type film bulk acoustic resonator (FBAR) is provided. The air-gap type FBAR includes a substrate which comprises an air gap portion having a substrate cavity formed in a top surface, a lower electrode formed on the substrate, a piezoelectric layer which is formed on the lower electrode and has one side forming an edge portion in the vicinity of a virtual edge according to vertical projection of the air gap portion, an upper electrode formed on the piezoelectric layer, a first electrode frame which comprises an open ring structure in plane, the open ring structure surrounding a part of a periphery of the piezoelectric layer on the lower electrode, and a second electrode frame positioned on the upper electrode and adjacent to an open portion of the open ring structure.

Abstract: The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

Abstract: Disclosed is an air-gap type film bulk acoustic resonator (FBAR) including a substrate including an air-gap portion with a top surface in which a substrate cavity is formed, a lower electrode formed above the substrate while surrounding the air-gap portion, a piezoelectric layer formed above the lower electrode, and an upper electrode formed above the piezoelectric layer corresponding to a virtual area formed according to a vertical projection of the air-gap portion. Here, the piezoelectric layer includes a void portion having a piezoelectric cavity between the lower electrode and the upper electrode, and the void portion is formed below an edge portion corresponding to an end part of the upper electrode.

Abstract: A SAW filter is a high-frequency filter including a common terminal, a transmission terminal and a reception terminal through which high-frequency signals are inputted and outputted. The SAW filter includes: a first filter circuit having a first frequency band as a pass band, and connected to the common terminal and the transmission terminal; a second filter circuit having a second frequency band different from the first frequency band as a pass band, and connected to the common terminal and the reception terminal; an antenna connected to the common terminal; and at least one inductor connected in series between the common terminal and the first filter circuit or the second filter circuit.

Abstract: A surface acoustic wave device includes a substrate, a first electrode and a second electrode formed on the substrate to extend along a first direction, wherein the first electrode and the second electrode are alternately disposed along the second direction, one end of the first electrode on one side of the first direction is aligned along the second direction, and one end of the second electrode on the other side of the first direction is aligned along the second direction, a temperature compensation film which covers the first electrode and the second electrode, a first additional film formed on the temperature compensation film to vertically overlap a partial region from the one end of the first electrode on the one side of the first direction, and a second additional film formed on the temperature compensation film to vertically overlap a partial region from the one end of the second electrode.

Abstract: Disclosed is an air gap type film bulk acoustic resonator (FBAR). The air gap type FBAR includes a substrate which includes an air gap portion in a top surface thereof, a lower electrode formed on the substrate, a piezoelectric layer formed on the lower electrode, and an upper electrode formed on the piezoelectric layer. Here, the lower electrode includes a first lower electrode formed spaced apart from the air gap portion in the substrate and a second lower electrode formed on the substrate to be separated from the first lower electrode by being stacked to surround only a part of a top of the air gap portion in order to form a non-deposition area of the air gap portion.

Abstract: A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.

Abstract: The present invention relates to a stacked piezoelectric ceramic element and can provide a stacked piezoelectric ceramic element produced by stacking two or more ceramic green sheets, the stacked piezoelectric ceramic element having a structure in which a ceramic porous or defective part constituting the stacked piezoelectric ceramic element is impregnated with an organic resin, thereby improving waterproof performance capable of preventing the deterioration of insulation resistance in a highly humid environment.

Abstract: A flip chip includes a substrate, an electrode pad layer stacked over the substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked over the electrode pad layer and the passivation layer, and a bump formed over the UBM layer. The width of an opening on which the passivation layer is not formed over the electrode pad layer is greater than the width of the bump. The flip chip can prevent a crack from being generated in the pad upon ultrasonic bonding.

Abstract: A wafer level package includes a substrate including bonding pads and a first protection dam and having a plurality of circuit pattern units disposed on a side; a printed circuit board having a plurality of connection pads, a second protection dam and via holes disposed thereon; and a connection unit connected to some of the plurality of connection pads and the second protection dam disposed on the printed circuit board. Freedom of design can be improved through the wafer level package and the manufacturing method thereof, and reliability of the wafer level package can be improved. The manufacturing process can be simplified as the bridge process is omitted when wiring is designed, and the size of an element may be reduced.

Abstract: A surface acoustic wave resonator includes: a piezoelectric substrate; a plurality of metal structures formed on a top surface of the piezoelectric substrate to have a negative profile; and a temperature compensation layer covering the top surface of the piezoelectric substrate and the plurality of metal structures. The surface acoustic wave resonator according to an embodiment of the present invention has a frequency characteristic insensitive to change of profile and has an effect of having a high semi-resonance Q value characteristic.

Abstract: Disclosed is a surface acoustic wave device including a piezoelectric substrate, first and second bus bars formed on the piezoelectric substrate to be opposite each other, a plurality of first inter-digital electrodes that are electrically connected to the first bus bar and extend from the first bus bar toward the second bus bar, and a plurality of second inter-digital electrodes that are electrically connected to the second bus bar and extend from the second bus bar toward the first bus bar, in which the first inter-digital electrodes and the second inter-digital electrodes are alternately arranged.

Abstract: The present invention relates to a filter module including a substrate, a plurality of filters formed on the substrate, an amplifier formed on the substrate, a connection part for connecting the plurality of filters and the amplifier to the substrate, and a cover layer formed on the substrate to cover the plurality of filters and the amplifier.

Abstract: A button device includes a piezoelectric element which includes a piezoelectric body with one surface on which a first external electrode and a second external electrode are formed and a plate with one surface attached to the other surface of the piezoelectric body, a supporting plate disposed on the one surface of the piezoelectric body, a cover disposed on the other surface of the plate, a first spacer provided between an edge portion of the one surface of the plate and the supporting plate, a second spacer provided between at least a part of an edge portion of the other surface of the plate and the cover to provide a separation space between the plate and the cover, and a dot provided in the separation space to transfer an external force to the piezoelectric element or to transfer a vibration of the piezoelectric element to the cover.

Abstract: A filter module includes an antenna, at least one filter configured to transmit a signal corresponding to a frequency of a predetermined band, and at least one amplification module connected to the filter and configured to amplify a signal. The filter includes a triplexer.