Abstract: A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

Abstract: The disclosure relates to a method of binder removal from a green body before sintering or the like wherein the green body is initially heated to a temperature above the melting or flow point of the binder to liquify the binder and, at the elevated temperature, a small portion of the green body is brought into intimate contact with a non-supporting porous body of lower capillarity potential for the liquid binder. The liquid is drawn from all parts of the green body to the region of contact between the porous body and the green body and enters the body of lower capillarity potential preferentially, removing liquid from the green body through the surface of the green body only at said region of contact. The draining is continued with or without further increase in temperature until the green body is opened or becomes permeable.

Abstract: A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

Abstract: Ductility is controlled by controlling the size of the particles of particulate material and/or the degree of sphericity of the particles, the smaller and/or more spherical the particles, the greater the ductility of the material. The material has preferably spherical pores, preferably hermetic, with a controlled ratio of pore volume to material volume to provide the property of compressibility. The particulate material itself must have the capability of becoming ductile. The ratio of pore volume to total volume of the material is controlled by particle size, sintering profile the property of the material and the initial volume loading of the pre-sintered part (i.e. the ratio of binder to particulate material). Some materials which are not ductile in and of themselves can be formed into ductile and/or compressible materials in accordance with the system of the present invention.

Abstract: The disclosure relates to a method of binder removal from a green body before sintering or the like wherein the green body is placed in a pressure chamber wherein the pressure is raised to a level above the vapor pressure of the binder in the green body at the ambient temperature within the pressure chamber. Where several binders are utilized simultaneously, the pressure within the chamber is maintained higher than the vapor pressure of the lowest of the binders then in the green body at the temperature within the green body. Under these conditions, the binder or binders will turn to a vapor, will follow the normal laws of evaporation and diffusion and diffuse out from the green body into the surrounding environment within the chamber. The binder can subsequently be removed from the chamber in conventional manner.