Abstract: A method for fabricating trihalodisilane, the method includes providing a halodisilane including at least four halogen atoms; reducing the halodisilane, using a mixed reducing agent including a first reducing agent represented by following Chemical Formula 1-1, in which RA is an alkyl group, and m and n are each independently 1 or 2, and m+n=3, and a second reducing agent represented by following Chemical Formula 2-1, in which RS is an alkyl group or an aryl group, p and q are each independently 1, 2, or 3, and p+q=4; and obtaining a product including a 1,1,1-trihalodisilane, (RA)m—Al—Hn??[Chemical Formula 1-1] (RS)p—Sn—Hq.
Type:
Application
Filed:
January 24, 2023
Publication date:
August 24, 2023
Applicant:
WONIK Materials Co., Ltd.
Inventors:
Ji Eun YUN, Byung Keun HWANG, Min Soo KANG, Sheby Mary GEORGE, Woo Ri BAE, Sun Hye HWANG, Seong Tae OH, Byeong Ok CHO
Abstract: The present invention relates to a ruthenium precursor compound, and more particularly, to a ruthenium precursor compound which is for providing ruthenium to an ammonia decomposition reaction catalyst and is represented by Formula CxHyOzNmRun, wherein x is an integer of 3 to 20, y is an integer of 0 to 32, z is an integer of 0 to 20, m is an integer of 0 to 10, and n is an integer of 1 to 3. In addition, the present invention relates to an ammonia reaction catalyst using the ruthenium precursor, and to a method for preparing the ammonia reaction catalyst, and provides an ammonia reaction catalyst having an excellent ammonia conversion rate at low temperatures, thereby being capable of efficient hydrogen production.
Type:
Application
Filed:
December 30, 2020
Publication date:
February 9, 2023
Applicants:
WONIK MATERIALS CO., LTD., KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventors:
Byeong Ok CHO, Young Lae KIM, Suk Yong JUNG, Sung Hun LEE, Sae Mi PARK, Myung Gon PARK, Min Soo KANG, Chang Won YOON, Hyun Tae SOHN, Jun Young CHA, Tae Ho LEE
Abstract: An etching gas composition includes a first organofluorine compound having 3 to 6 carbon atoms, and an organosulfur compound having 1 to 4 sulfur atoms. The organosulfur compound may include a carbon-fluorine (C—F) bond, a carbon-sulfur (C—S) bond, at least one carbon-carbon double (—C?C—) bond. When the etching gas composition is used, excellent etch selectivity may be obtained, and the linearity and verticality of a pattern may be greatly increased by improving line edge roughness (LER) and line width roughness (LWR) due to an improvement in the roughness of an etched surface.
Type:
Application
Filed:
March 23, 2022
Publication date:
September 29, 2022
Applicant:
Wonik Materials
Inventors:
Dohoon KIM, Wonwoong CHUNG, Taehyung KIM, Heejun PARK, Handuck SONG, Heonjong JEONG, Younglae KIM, Byeongok CHO
Abstract: An etching gas mixture, a method of forming a pattern using the etching gas mixture, and a method of manufacturing an integrated circuit device using the etching gas mixture, the etching gas mixture including a C1-C3 perfluorinated alkyl hypofluorite; and a C1-C10 organosulfur compound that includes a C—S bond in the compound.
Abstract: An etching gas mixture, a method of forming a pattern using the etching gas mixture, and a method of manufacturing an integrated circuit device using the etching gas mixture, the etching gas mixture including a C1-C3 perfluorinated alkyl hypofluorite; and a C1-C10 organosulfur compound that includes a C—S bond in the compound.
Type:
Application
Filed:
September 27, 2018
Publication date:
May 16, 2019
Applicant:
Wonik Materials
Inventors:
Do-hoon KIM, Tae-hyung KIM, Jong-min BAEK, Han-dock SONG