Abstract: Integrally bonded composite polyurethane foams substantially free from coalescence and with no discernable bond or structural interface layer when viewed at 50× magnification can be formed by wet casting a second foamed polyurethane composition onto a first wet cast foamed polyurethane composition and simultaneously curing the cast foams. In a preferred embodiment, one curable polyurethane composition forms a slow recovery foam and the other curable polyurethane composition forms a resilient foam.

Abstract: A multi-layer circuit board comprises a liquid crystalline polymer bond ply disposed between two circuit layers wherein the liquid crystalline polymer bond ply is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/° C. and further wherein the multi-layer circuit is formed by lamination at a temperature of 0° C. to about 10° C. less than the melt temperature of the liquid crystalline polymer.

Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper).

Abstract: A load beam for a suspension assembly comprises a liquid crystal polymer layer disposed between and in intimate contact with a first metal layer and a second metal layer, preferably stainless steel. Such load beams have improved dimensional and hygrothermal stability, as well as greater ease of processing over conventional load beams, allowing tailoring of bend and flex properties.

Abstract: Compositions for the formation of temperature resistant, tough, flame retardant polyurethane foams, comprising a low VOC polyisocyanate component wherein the isocyanate is a low functionality isocyanate; a low VOC active-hydrogen containing component substantially reactive with the low functionality isocyanate to form a polyurethane; a surfactant composition; and a catalyst component, wherein the total mass loss of the foam is less than 1% by weight as measured by ASTM E595. The foams are useful as gasketing materials, for example.

Abstract: Polymeric organic coating for electroluminescent lamp components, particularly for phosphor particles and electrodes and a method of making same, wherein the polymer is formed using an initiator, preferably by ring-opening metathesis polymerization. A dense hydrophobic organic coating is formed which is capable of protecting the electroluminescent device components from exogenous agents such as moisture and eventual degradation. The polymer layer may be attached to an outer surface of the component by one or more tethering layers.

Abstract: The present invention relates to a bus bar assembly comprising a high power transistor module directly mounted to a bus bar. The bus bar has an improved solderability characteristic and is designed so that a solid, effective soldered connection results during a conventional soldering process in which the high power transistor module is securely mounted to the bus bar to form the bus bar assembly of the present invention. Accordingly, the soldering process involves soldering a pin which is a part of the high power transistor module to a surface of the bus bar using sufficient heat. The improved solderabilty of the present bus bar results by forming a soldering island in the bus bar at predetermined points thereof. The soldering island comprises a central soldering opening, which receives the soldering pin, and a plurality of thermal barrier openings distributed around the soldering opening.

Abstract: A multi-layer circuit comprises a circuit and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer resin laminated to a conductive layer. Such multi-layer circuits are particularly useful for high density circuit applications.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

Abstract: The present invention is a liquid crystal polymer suspension assembly. This assembly comprises a stainless steel layer and an electrically conductive layer with a dielectric liquid crystal polymer layer disposed therebetween and bonded thereto. Due to controlled coefficient of thermal expansion, modulus, and very low moisture absorption of the liquid crystal polymer, the suspension assembly of the present invention will have improved dimensional and hygrothermal properties over conventional assemblies, enabling higher density, higher performance assemblies to be produced.

Abstract: An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polyisoprene resin, an ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant additive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strength and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: A conductive elastomeric foam composite is presented, comprising an elastomer foam and polypyrrole, thiophene, or aniline and derivatives thereof. The foam is manufactured by first diffusing an oxidant into the dense polymer phase of a solvent-swollen foam and then diffusing pyrrole or pyrrole derivative vapor or solution into the dried foam, resulting in an in situ chemical oxidative polymerization of pyrrole at the oxidant site. Only about 5 wt % of conductive polymer is required for observing an insulator to conductor transition. The conductivity of the composite foam can be effectively controlled between 10−7 and 10−1 S/cm by varying either the amount of oxidant used and/or the copolymer composition.

Abstract: An electroluminescent lamp is presented, wherein at least one of the phosphor layer or the dielectric layer comprises a polyureasilazane polymer. The polyureasilazane may be added to the fluoropolymer resin of the phosphor layer or the dielectric layer, and/or may be used to coat the phosphor particles within the phosphor layer or the inorganic filler particles within the dielectric layer. Use of polyureasilazanes confers enhanced adhesion and environmental resistance.

Abstract: A document feed component is presented comprising a foamed epichlorohydrin elastomer, a curing agent, and a blowing agent, wherein the document feed component has a dynamic coefficient of friction in the range of about 1.0 to about 3.0, a Shore O hardness in the range of about 2 to about 85, a compression set of less than about 12%, and a resistance to wear of less than about 0.05 g/hr. The elastomer optionally further includes activators, polymerization accelerators, and a filler material. An important feature of the present invention is that the use of a foamed epichlorohydrin elastomer does not require the use of processing aids and migratory additives.

Abstract: A method for making a particulate filled polymeric matrix composite film includes mixing a polymeric matrix material with a dispersion of particulate filler in a carrier liquid to form a casting composition and adjusting the viscosity of the casting composition to retard separation of the particulate filler from the composition. A layer of the viscosity-adjusted casting composition is cast on a substrate and the layer is consolidated to form the particulate filled polymer matrix composite film. Films made by the method include very thin, e.g less than 1.0 mil, fluoropolymeric matrix films highly filled with very small diameter, preferably spherical, particles for use as, e.g. dielectric substrate materials in laminar electrical circuits.

Abstract: A conductive elastomeric foam composite is presented, comprising an elastomer foam and polypyrrole, thiophene, or aniline and derivatives thereof. The foam is manufactured by first diffusing an oxidant into the dense polymer phase of a solvent-swollen foam and then diffusing pyrrole or pyrrole derivative vapor or solution into the dried foam, resulting in an in situ chemical oxidative polymerization of pyrrole at the oxidant site. Only about 5 wt % of conductive polymer is required for observing an insulator to conductor transition. The conductivity of the composite foam can be effectively controlled between 10.sup.-7 and 10.sup.-1 S/cm by varying either the amount of oxidant used and/or the copolymer composition.

Abstract: A document feed component is presented comprising a foamed epichlorohydrin elastomer, a curing agent, and a blowing agent. The elastomer optionally further includes activators, polymerization accelerators, and a filler material. An important feature of the present invention is that the use of a foamed epichlorohydrin elastomer in accordance with the present invention does not require the use of processing aids and migratory additives. Consequently, the document feed component of this invention has the advantage of not contaminating paper or other media with which they come into contact, even for extended periods of time, while maintaining other advantageous properties, such as a high coefficient of friction, low hardness, low compression set, and excellent resistance to ultraviolet light and ozone. The document feed component of the present invention may be shaped as a roller, wheel, belt, pad or the like.

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene in an amount of about 15 to about 50 volume %; a fabric reinforcement in an amount of 0 to about 40 volume %; a particulate filler, preferably ceramic, in an amount of from 0 to about 60 volume %; microballoons in an amount from 0 to about 60 volume %; and optionally a flame retardant. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators.