Abstract: An apparatus for packaging a semiconductor device and a method for packaging the same. The apparatus includes a closed printing chamber having a baseplate on the bottom of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank is located in the closed printing chamber.

Abstract: An etching device capable of forming a uniform etchant film. The etching device is disposed on a plurality of parallel and coplanar hollow sheet-type rollers used to support a double-sided board. A plurality of first etchant nozzles is disposed under the hollow sheet-type rollers. The device has several solid rollers, several rows of second etchant nozzles and several rows of air nozzles. The solid rollers are coplanarly disposed over the hollow sheet-type rollers and are parallel to each other. The adjacent solid rollers comprise an interval, and the intervals are divided into several first intervals and several second intervals. The solid rollers touch the double-sided board to make an etchant film covering the double-sided board more uniform. The rows of second etchant nozzles are disposed over the first intervals and parallel to axes of the solid rollers. The rows of air nozzles are disposed over the second intervals and parallel to the axes of the solid rollers.

Abstract: An apparatus for manufacturing a plug and the manufacturing method. The method includes the following steps. A baseplate located in the bottom of a closed printing chamber is provided. A printed circuit board and a stencil are mounted on the baseplate in sequence. The stencil is aligned to the printed circuit board. An amount of preheated paste is placed on the stencil. A pressure of the closed printing chamber is adjusted to a first pressure. A printing step is performed to form plugs in the printed circuit board. The pressure of the closed printing chamber is adjusted to a second pressure to remove voids trapped in the plugs. The pressure of the closed printing chamber is adjusted to a third pressure. A scraping step is performed to remove the redundant paste.

Abstract: A printed circuit board thermal conductive structure comprises a thermal spreader layer having an embossed pattern formed on its surface, an adhesive glue layer formed over the thermal spreader, and a surface metallic layer attached to the thermal spreader and the glue layer. A portion of the surface metallic layer is in direct contact or almost direct contact with the thermal spreader. Furthermore, an additional external heat sink can be attached to thermal conductive structure to increase the efficiency of heat dissipation.

Abstract: A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive layer for attaching the substrate to the heat sink. The substrate is formed of multiple layers of printed circuit boards which are attached to each other, and have a cavity formed at the center thereof. A plurality of thermal vias is formed surrounding the substrate. The head sink is divided into a chip mount area and a thermal via joint area. The chip mount area is used for a chip mount pad to be disposed thereon, wherein a chip is connected to the heat sink through the chip mount pad. The thermal via area is electrically coupled to the thermal vias thereby to form an approximate short path or a short path. Thus, heat energy is transferred not only by the heat sink directly, but also from the heat sink to the substrate through the thermal vias.

Abstract: An apparatus for manufacturing plug and the manufacturing method is described. The method comprises providing a baseplate on a bottom surface of a sealed printing chamber. The printed circuit board and a stencil on the baseplate are sequentially mounted on the baseplate. Several cameras are used to align the holes of the printed circuit board and the stencil. A proper amount of preheated paste is printed on the stencil. The sealed printing chamber is adjusted to a first pressure to perform a paste-printing step for filling the hole of the printed circuit board with paste. The sealed printing chamber is adjusted to a second pressure. The sealed printing chamber is adjusted to a third pressure to perform a scraping step for remove redundant paste.

Abstract: A method of manufacturing a thermal conductive structure on a printed circuit board comprises the steps of forming a thermal conductive layer having an embossed pattern on its surface, and then forming an adhesive glue layer over the thermal conductive layer. Next, a surface metallic layer is attached to the thermal conductive layer and the glue layer, wherein a portion of the surface metallic layer corresponding to the embossed portion of the heat spreader is in direct contact or almost direct contact with the thermal conductive layer. Furthermore, an additional external heat sink can be attached to thermal conductive structure for increasing the efficiency of heat dissipation.