Abstract: A semiconductor flash memory cell. A p-well is formed in a semiconductor substrate. A thin oxide layer is formed over the p-well and semiconductor substrate. A dielectric pillar extending up from the semiconductor substrate is formed to support a control gate. A select gate is formed that extends underneath the control gate to be between the control gate and the thin oxide layer. Next, a floating gate is formed to extend underneath the control gate to be between the control gate and the thin oxide layer. A source region is formed in the p-well to be adjacent to the floating gate. Finally, a drain is formed in the p-well, the drain formed adjacent to the select gate.

Abstract: An ETOX cell formed in a semiconductor substrate is disclosed. The ETOX cell includes a p-well formed within the substrate. A floating-gate is formed above the p-well, the floating-gate being separated from the substrate by a thin oxide layer. Next, a control gate is formed above the floating-gate, the floating-gate and the control gate being separated by a dielectric layer. A drain region is formed in the p-well and adjacent to a first edge of the floating-gate. The drain region is of a first dopant type. Finally, a source region is formed in the p-well and adjacent to a second edge of the floating-gate, the source region being of a second dopant type.