Abstract: A temperature-pressure sensor includes a shell, a pressure sensitive component provided in the shell and a temperature sensitive component provided in the lower cavity. The shell is provided with a fluid inlet. The pressure sensitive component includes a ceramic plate laterally extended. The temperature sensitive component includes a temperature sensor, and two connection ends of the temperature sensor are respectively electrically connected to the circuit board through an elastic connection body, a conductive pin and a conductor. The conductive pin is respectively correspondingly penetrated through two via holes opened on the ceramic plate, and a gap between the conductive pin and the corresponding via hole is sealed by a seal body made of glass material; and the fluid inlet is communicated with the lower cavity.

Abstract: A pressure sensor has a housing, an air lead-in hole, a pressure lead-in hole, an inner cavity, a sensor chip, a lead frame and a cover plate. One end of the air lead-in hole is in communication with the inner cavity of the housing, and the other end of the air lead-in hole is in communication with the air; the pressure lead-in hole is perpendicularly disposed at the center of the upper surface of the housing, two steps are disposed on the upper surface of the inner cavity, and a horizontal surface-mounted device surface is disposed on each of the steps. The center of the sensor chip is aligned with the centers of the pressure lead-in hole, and the lower end of the pressure lead-in holes are in communication with the cavity of the sensor chip.

Abstract: A pressure sensor has a housing, an air lead-in hole, a pressure lead-in hole, an inner cavity, a sensor chip, a lead frame and a cover plate. One end of the air lead-in hole is in communication with the inner cavity of the housing, and the other end of the air lead-in hole is in communication with the air; the pressure lead-in hole is perpendicularly disposed at the center of the upper surface of the housing, two steps are disposed on the upper surface of the inner cavity, and a horizontal surface-mounted device surface is disposed on each of the steps. The center of the sensor chip is aligned with the centers of the pressure lead-in hole, and the lower end of the pressure lead-in holes are in communication with the cavity of the sensor chip.