Abstract: A highly conductive transparent glass-based circuit board includes a glass substrate. The glass substrate is a glass-tempered substrate. A surface of the glass-tempered substrate faces air. A conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass-tempered substrate. The surface of the glass-tempered substrate and an upper surface of the conductive circuit are at the same level. A surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer. The conductive circuit is tightly fused with the glass substrate. It is a fusional relation between the conductive circuit and the glass substrate. A surface of the glass substrate and an upper surface of the conductive circuit are at the same level.

Abstract: A highly conductive transparent laminated glass article includes two glass plates and an adhesive film. The adhesive film has a material of Poly(Vinyl Butyral) (PVB) resin and is located between the two glass plates. At least one of the two glass plates is a highly conductive transparent glass-based circuit board with a glass substrate. A surface of the glass substrate is not contact with the adhesive film. A conductive paste, printed on the surface of the glass substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate. The surface of the glass substrate and an upper surface of the conductive circuit are at the same level. The highly conductive transparent laminated glass article has the characteristics of high conductivity and high light transmittance. The highly conductive transparent laminated glass article is suitable for fabrication, manufacture, and use of industrial and smart-home devices.