Abstract: A manufacturing method of identifiable print circuit board includes a step of “disposing an identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board.

Abstract: An etched capacitor laminate for reducing electrical noise. The etched capacitor laminate is configured to be an element of a printed circuit board. The etched capacitor laminate comprises a first conductive sheet, an intermediate sheet of dielectric material, and a second conductive sheet. The first conductive sheet further comprises a plurality of etched forms wherein each of the etched forms is causing a local capacitive effect and a local inductive effect. The local capacitive effect and local inductive effect generates a plurality of local filters that reduce electrical noise. The intermediate sheet of dielectric material is bonded to the first conductive sheet, and the second conductive sheet is also bonded to the intermediate sheet.