Patents Assigned to Wuxi Huaying Microelectronics Technology Co., Ltd.
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Patent number: 11417542Abstract: A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit. Each semiconductor processing unit includes a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, as well as at least one second channel connecting to the recess at the peripheral. Each of the first channel and the at least one second channel serves as an inlet or an outlet via which a fluid enters or exits the recess. A method according to the present disclosure may control a flowing direction of a fluid flowing across a substrate surface.Type: GrantFiled: April 14, 2020Date of Patent: August 16, 2022Assignee: Wuxi Huaying Microelectronics Technology Co., LtdInventors: Sophia Wen, Zhikai Wang
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Patent number: 11101148Abstract: A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit that has a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, and at least one second channel connecting to the recess at the peripheral. Each of the first and second channels serves as an inlet or an outlet via which a fluid enters or exits the recess.Type: GrantFiled: March 18, 2016Date of Patent: August 24, 2021Assignee: Wuxi Huaying Microelectronics Technology Co., LtdInventors: Sophia Wen, Zhikai Wang
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Patent number: 10766665Abstract: The present disclosure provides a chemical container and a method for manufacturing the same. The chemical container comprises a head portion having a top wall and a head sidewall extending from an edge of the top wall, as well as a body portion jointed with the head portion and defining a chamber together with the head portion. The top wall has a mouth structure configured for one or more pipelines to pass through and connect with the chamber. The manufacturing method is simple and of low cost, and the resulted chemical container is able to withstand a greater internal pressure and is configured to collect any leaking liquid chemicals.Type: GrantFiled: November 6, 2018Date of Patent: September 8, 2020Assignee: Wuxi Huaying Microelectronics Technology Co., Ltd.Inventor: Sophia Wen
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Publication number: 20200243349Abstract: A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit. Each semiconductor processing unit includes a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, as well as at least one second channel connecting to the recess at the peripheral. Each of the first channel and the at least one second channel serves as an inlet or an outlet via which a fluid enters or exits the recess. A method according to the present disclosure may control a flowing direction of a fluid flowing across a substrate surface.Type: ApplicationFiled: April 14, 2020Publication date: July 30, 2020Applicant: Wuxi Huaying Microelectronics Technology Co., LtdInventors: Sophia Wen, Zhikai Wang
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Patent number: 10586717Abstract: A semiconductor processing apparatus is provided. The apparatus includes a first chamber portion and a second chamber portion movable relative to the first chamber portion between an open position and a closed position. The first chamber portion includes a recessed area formed on an internal surface of the first chamber portion. The first chamber portion also includes one or more through-holes connected to respective locations of the recessed area. When the second chamber portion is in the closed position and a semiconductor wafer is housed in the micro chamber, the recessed area is sealed by a surface of the semiconductor wafer to form a closed channel. The surface may be processed by a processing fluid flowing in the closed channel. Accordingly, a flowing direction and a flowing speed of the processing fluid may be accurately controlled, and an amount of the processing fluid consumed may be greatly reduced.Type: GrantFiled: December 21, 2015Date of Patent: March 10, 2020Assignee: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTDInventors: Sophia Wen, Zhikai Wang
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Patent number: 10475639Abstract: An apparatus and a method for processing one or more surfaces of a semiconductor wafer with one or more ozone-containing fluids are provided. The apparatus includes an ozone generator, a solvent flask, a gas-liquid mixing device, and a processing chamber capable of receiving the semiconductor wafer. The apparatus may also include one or more gas-liquid separation devices and switching valves. The processing chamber allows the ozone-containing fluids to enter the processing chamber for treating the wafer surface. The effectiveness of the treatment is ensured by enhancing the ozone concentration of the ozone-containing fluids inside the processing chamber, in either or both gas and liquid phases. The employment of a micro chamber as the processing chamber also helps to reduce the consumption of the treatment gas and liquid, as well as the resulted waste emission.Type: GrantFiled: July 29, 2015Date of Patent: November 12, 2019Assignee: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTDInventors: Sophia Wen, Nitao Zhang
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Patent number: 10283389Abstract: Disclosed is an adjustable semiconductor processing apparatus and a control method thereof. The apparatus comprises a micro chamber with an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface that are relatively moveable towards each other between an open position and a closed position. When the chamber is in the closed position, a cavity formed by the upper working surface and the lower working surface defines a gap between the upper working surface, the lower working surface and a semiconductor wafer received in the cavity for flow of a processing fluid. A drive device enables the upper working surface of the upper chamber portion or/and the lower working surface of the lower chamber portion to tilt or deform to control flow of chemical agents within the micro chamber.Type: GrantFiled: December 30, 2011Date of Patent: May 7, 2019Assignee: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTDInventor: Sophia Wen
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Patent number: 10196172Abstract: The present disclosure provides a chemical container and a method for manufacturing the same. The chemical container comprises a head portion having a top wall and a head sidewall extending from an edge of the top wall, as well as a body portion jointed with the head portion and defining a chamber together with the head portion. The top wall has a mouth structure configured for one or more pipelines to pass through and connect with the chamber. The manufacturing method is simple and of low cost, and the resulted chemical container is able to withstand a greater internal pressure and is configured to collect any leaking liquid chemicals.Type: GrantFiled: March 10, 2015Date of Patent: February 5, 2019Assignee: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTD.Inventor: Sophia Wen
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Patent number: 10121681Abstract: Embodiments of a semiconductor processing apparatus are disclosed. The semiconductor processing apparatus includes a micro chamber for tightly accommodating and processing a semiconductor wafer. The micro chamber includes an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface. The upper chamber portion and the lower chamber portion are relatively movable between an open position for loading and removing the semiconductor wafer and a closed position for tightly accommodating the semiconductor wafer. The semiconductor processing apparatus adopts a modified column device, a lower chamber portion and a balance correction device to achieve easy operation and maintenance, better prevention of chemical processing fluid leakage, and corrosion-resistant design.Type: GrantFiled: April 14, 2012Date of Patent: November 6, 2018Assignee: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTDInventor: Sophia Wen
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Patent number: 9859134Abstract: The present disclosure provides a multi-chamber semiconductor processing apparatus including at least two micro chambers for receiving and processing a semiconductor wafer. Each micro chamber includes an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface. The upper chamber portion and the lower chamber portion are relatively movable between an open position for loading or removing the semiconductor wafer and a closed position for receiving and processing the semiconductor wafer. Compared with the prior art, the multi-chamber semiconductor processing apparatus of the present disclosure are provided with a plurality of micro chambers in a longitudinal direction, which enables the multi-chamber semiconductor processing apparatus to carry out single-wafer chemical processing on a plurality of semiconductor wafers at the same time.Type: GrantFiled: December 31, 2011Date of Patent: January 2, 2018Assignee: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTDInventor: Sophia Wen
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Publication number: 20150079802Abstract: Disclosed is an adjustable semiconductor processing apparatus and a control method thereof. The apparatus comprises a micro chamber with an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface that are relatively moveable towards each other between an open position and a closed position. When the chamber is in the closed position, a cavity formed by the upper working surface and the lower working surface defines a gap between the upper working surface, the lower working surface and a semiconductor wafer received in the cavity for flow of a processing fluid. A drive device enables the upper working surface of the upper chamber portion or/and the lower working surface of the lower chamber portion to tilt or deform to control flow of chemical agents within the micro chamber.Type: ApplicationFiled: December 30, 2011Publication date: March 19, 2015Applicant: Wuxi Huaying Microelectronics Technology Co., Ltd.Inventor: Sophia Wen
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Publication number: 20140158299Abstract: The present disclosure provides a multi-chamber semiconductor processing apparatus including at least two micro chambers for receiving and processing a semiconductor wafer. Each micro chamber includes an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface. The upper chamber portion and the lower chamber portion are relatively movable between an open position for loading or removing the semiconductor wafer and a closed position for receiving and processing the semiconductor wafer. Compared with the prior art, the multi-chamber semiconductor processing apparatus of the present disclosure are provided with a plurality of micro chambers in a longitudinal direction, which enables the multi-chamber semiconductor processing apparatus to carry out single-wafer chemical processing on a plurality of semiconductor wafers at the same time.Type: ApplicationFiled: December 31, 2011Publication date: June 12, 2014Applicant: WUXI HUAYING MICROELECTRONICS TECHNOLOGY CO., LTDInventor: Sophia Wen
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Publication number: 20140034238Abstract: Embodiments of a semiconductor processing apparatus are disclosed. The semiconductor processing apparatus includes a micro chamber for tightly accommodating and processing a semiconductor wafer. The micro chamber includes an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface. The upper chamber portion and the lower chamber portion are relatively movable between an open position for loading and removing the semiconductor wafer and a closed position for tightly accommodating the semiconductor wafer. The semiconductor processing apparatus adopts a modified column device, a lower chamber portion and a balance correction device to achieve easy operation and maintenance, better prevention of chemical processing fluid leakage, and corrosion-resistant design.Type: ApplicationFiled: April 14, 2012Publication date: February 6, 2014Applicant: Wuxi Huaying Microelectronics Technology Co., Ltd.Inventor: Sophia Wen