Patents Assigned to WUXI TACLINK OPTOELECTRONICS TECHNOLOGY CO., LTD.
  • Publication number: 20220385023
    Abstract: An optical fiber amplifier compatible with a small form-factor pluggables (SFP+) package includes a housing, and a circuit device and an optical path device that are disposed in the housing, where the housing includes a structure compatible with an SFP+ package and is provided with an accommodation space; both the circuit device and the optical path device are located in the accommodation space, and the optical path device is located below the circuit device; the circuit device is provided with a card edge connector, and the card edge connector can be exposed outside the housing. The optical fiber amplifier compatible with an SFP+ package has a compact internal space. The amplifer has an appearance compatible with a standard SFP+ package. An electrical interface pin also meets a requirement of an existing SFP+ package, and dynamic plugging and plug-and-play can be satisfied.
    Type: Application
    Filed: July 30, 2020
    Publication date: December 1, 2022
    Applicant: WUXI TACLINK OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jinlong CHEN, Songgui WU, Jianhua HOU, Yunbin FENG, Xianqin LI