Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

Abstract: Compact and integral arrangements for an energy-conditioning arrangement having various predetermined energy pathways utilized in part for the purpose of conditioning energies of either one or multiple of circuitry. Some energy-conditioning arrangement variants can be operable to provide multiple, energy-conditioning operations.

Abstract: A predetermined electrode arrangement (1/1, 1/2, 1/3A, 1/6) comprising a plurality of shielded electrodes (213, 215) and a plurality of shielding electrodes (204, 214, 269A, 269B,) that together with other conductive (799, 206, 208, 207, 203, 218, 216, 217, 218) semi-conductive (not shown) and/or non-conductive material elements (212) are formed into a multi-functional energy condition assembly (1-1, 1-2, 1-3A, 1-6) or variant to be selectively coupled into circuitry (4-1, 5-1, 1-2).

Abstract: A predetermined single electrode shielding set for groupings of complementary electrodes that are operable to shield and that together are selectively formed or amalgamated into a predetermined sequential combination of commonly configured energy pathways operable for shielding various paired complementary electrodes and other predetermined elements that result in an electrode architecture practicable to provide multiple energy conditioning functions.

Abstract: Compact and integral arrangements for an energy-conditioning arrangement (800q) having various predetermined pathways (813a, 813b) utilized in part for the purpose of conditioning energies of either one or multiple of circuitry that would otherwise detrimentally effect a predetermined application having a single or multiple, circuitry systems. Some energy-conditioning variants can be operable to provide multiple-conditioning operations.

Abstract: A structure comprising: a first electrode; a second electrode; a shielding electrode provides improved energy conditioning when used in electrical circuits. The structures may exist as discrete components, as part of an interposer or a first level interconnects, or a part of an integrated circuit.

Abstract: The invention provides a structure and method of its use comprising a filtering and interference suppression device (62), particularly of the broad band type, for an electric motor (34) comprising at least a first powering brush (16) for an armature commutator of the electric motor (34), of the type comprising a capacitor (64), one terminal of which is electrically connected to a strip conductor (38) that electrically powers the first brush (16) powering the armature commutator of the electric motor (34), and the other terminal of which is electrically connected to a ground strip conductor (58), connected, in turn, to the electrical ground (60) of the electric motor (34), characterized in that the capacitor (72) of the filtering and interference suppression device (62) is of the non-inductive type, and in that each of the non-inductive capacitors (72) is directly attached to a circuit board (73) comprising strip conductors, of which are at least one powering strip conductor (38, 40) for a brush and one ground

Abstract: A predetermined amalgamation of electrodes formed or manufactured at least in part, by predetermined, sequential manufacturing operations into a balanced and shielding electrode structure. The balanced total electrode structure also uses a grouping of identically configured, and balanced positioned, shielding electrodes that are amalgamated in sequential combination with predetermined, complimentary balanced shielded electrodes groupings and other predetermined elements that are together, practicable to provide predetermined multiple energy conditioning functions operable upon portions of propagating energy as well simultaneously being operable to provide a common, voltage reference function operable for at least dynamic circuit operations.

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: The present invention is a surface mount component carrier comprised of a disk of insulating material having at least two apertures. The disk is substantially covered by a metalized ground surface and includes at least two conductive pads surrounding the apertures, and insulating bands which surround each conductive pad. The insulating bands separate and electrically isolates the conductive pads from the metalized ground surface. A surface mount component, such as a differential and common mode filter, is positioned lengthwise between the two conductive pads and operably coupled to the carrier. Once the surface mount component is coupled to the carrier, the combination can be manipulated, either manually or through various types of automated equipment, without subjecting the surface mount component to mechanical and physical stresses normally associated with the handling of miniature components.

Abstract: The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters.

Abstract: An energy conditioning structure comprised of any combination of multilayer or monolithic energy conditioners with operable conductors, all selectively arranged and shielded for attachment to at least a conductive substrate.

Abstract: The present invention is a component carrier comprising a plate of insulating material having a plurality of apertures for accepting the leads of a thru-hole differential and common mode filter. Another embodiment comprises a surface mount component carrier comprised of a disk of insulating material having a plurality of apertures. The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently or embedded within electronic connectors, or configured for use with electric motors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an electrical circuit conditioning assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters.

Abstract: The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

Abstract: The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

Abstract: A fuse and filter arrangement having a polymer fuse apparatus that provides bypass fuse protection. A polymer bypass fuse includes of an electrical conductor wherein a portion of the conductor is surrounded by an internal electrode, which is then surrounded by a layer of polymeric positive temperature coefficient (PTC) material, which is then surrounded by a conductive material similar to that of the internal electrode. The fuse and filter arrangement includes a plurality of in-line and bypass fuses combined with a differential and common mode filter, which itself consists of a plurality of common ground conductive plates maintaining first and second electrode plates between the various conductive plates, all of which are surrounded by a material having predetermined electrical characteristics to provide fail safe filter and circuit protection.

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: The present invention relates to a universal multi-functional common conductive shield structure plus two electrically opposing differential energy pathways which in part uses a electrode shielding architecture with stacked conductive hierarchy progression comprising circuitry for energies propagating simultaneous along paired and electrically differential pathways that utilize bypass or feed-thru energy propagation modes. The invention, when energized, will allow both the outer partially shielded paired differential conductive energy pathway electrodes, as well as the contained and oppositely paired differential conductive energy pathway electrodes to function with respect to one another, in complementary, yet in an electrically opposite manner, respectively.

Abstract: The present invention is a surface mount component carrier comprised of a disk of insulating material having at least two apertures. The disk is substantially covered by a metalized ground surface and includes at least two conductive pads surrounding the apertures, and insulating bands which surround each conductive pad. The insulating bands separate and electrically isolates the conductive pads from the metalized ground surface. A surface mount component, such as a differential and common mode filter, is positioned lengthwise between the two conductive pads and operably coupled to the carrier. Once the surface mount component is coupled to the carrier, the combination can be manipulated, either manually or through various types of automated equipment, without subjecting the surface mount component to mechanical and physical stresses normally associated with the handling of miniature components.

Abstract: A fuse and filter arrangement having a polymer fuse apparatus that provides bypass fuse protection. A polymer bypass fuse includes of an electrical conductor wherein a portion of the conductor is surrounded by an internal electrode, which is then surrounded by a layer of polymeric positive temperature coefficient (PTC) material, which is then surrounded by a conductive material similar to that of the internal electrode.