Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.

Abstract: An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.

Abstract: A verification probe system is configured to verify an automated test platform and includes: an integrated circuit test probe assembly; and a moveable platform configured to position the integrated circuit test probe assembly proximate one of more conductive pins included within a test socket assembly of the automated test platform.

Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.

Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: A test socket assembly including a contactor body having a socket opening sized and configured to receive a device under test therein, and one or more waveguides at least partially disposed within the contactor body or external to the contactor body. The assembly further including at least one waveguide antenna probe coupled with the one or more waveguides, where the at least one waveguide antenna probe including a first set of sides and a second set of sides, at least one of the first set of sides are flared out away from the longitudinal axis.

Abstract: A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Abstract: A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.

Abstract: A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

Abstract: The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe. The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

Abstract: A high speed circuit assembly includes a high speed circuit including at least one transmission line extending to a transmission line end, and radar absorbing material disposed adjacent the transmission line.

Abstract: A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Abstract: A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

Abstract: A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and determine if one or more of the plurality of monitored current values exceeds one or more of a plurality of current thresholds.

Abstract: A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, and monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages. The plurality of monitored current values are stored.

Abstract: A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.