Abstract: A system for separating ICs, including a controller, a fixture and a support material supply. The fixture is coupled to a stretchable substrate and the stretchable substrate has a diced semiconductor wafer secured thereto. The diced semiconductor wafer including the plurality of ICs. The fixture being capable of stretching the stretchable substrate so as to form a corresponding plurality of spaces between each of the plurality of ICs.
Abstract: A method of separating an IC. The method includes dicing a semiconductor wafer. The semiconductor wafer includes multiple ICs. The diced wafer is secured to a stretchable substrate. The stretchable substrate can be stretched so as to form corresponding spaces between each of the ICs. The corresponding spaces are filled with a support material. A system for separating ICs on a semiconductor wafer is also disclosed.
Abstract: A method of separating an IC. The method includes dicing a semiconductor wafer. The semiconductor wafer includes multiple ICs. The diced wafer is secured to a stretchable substrate. The stretchable substrate can be stretched so as to form corresponding spaces between each of the ICs. The corresponding spaces are filled with a support material. A system for separating ICs on a semiconductor wafer is also disclosed.
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