Abstract: A process for manufacturing insulating ceramic inserts used as sealed passages for electrical conductors through a metallic wall, is described wherein a green ceramic plate is subjected to silk-screen printing with the aid of a conducting ink, generally in ring-shaped patterns. The patterns are pressed and holes are pierced through the center of the ring and through at least one other green plate. The silk-screen printed plate is pressed against the at least one other green plate, or between two other green plates, bringing the holes into coincidence. A cut-out is made around each of the holes and the outer lateral surface of the part obtained is metallized. The part is then heat treated in order to fire and sinter same. It also is possible for the sintering to be performed before the metallization of the outer lateral surface.

Abstract: The invention concerns a monolithic substrate for an electronic power component which is formed by a sintered stack of layers of dielectric material having an internal system of ducts for the circulation of a cooling fluid. The system is a closed system which opens at the surface of the substrate by way of two orifices which respectively provide for the intake of the pressurized fluid into the internal system of ducts and the removal thereof from said system.

Abstract: A housing or box for dissipation of the heat produced by electrical circuits. The housing includes a metallic armature which has an upper portion with a hermetic recess in which are disposed the electrical circuits, and a lower portion for cooling with a cooling fluid. The cooling portion includes a single-piece metallic assembly in which are formed channels and openings between the channels in such a way that a circulation network for the cooling fluid is formed.

Abstract: A dielectric ceramic substrate is obtained exclusively from aluminum oxide, magnesium oxide and titanium oxide, the respective amounts of said magnesium oxide and said titanium oxide being so selected as to represent substantially equivalent molar proportions. The novel substrate is adapted to be used in electronics in the fields of thin layer and thick layer technology, as well for producing microprocessor protection cases, multilayer substrates and the like.