Patents Assigned to XHP Microsystems, Inc.
  • Publication number: 20050104144
    Abstract: An electromechanical system, the system comprising a first surface with an electrically activated electrode coupled to the first surface and to an electrical source to receive a first signal. The system further comprising a moveable structure suspended at a first height over the first surface, the moveable structure being attracted toward the electrode based upon the first signal, and the moveable structure being attracted toward the first surface through an interaction with one or more parasitic forces. The systems also provides a landing post coupled to the moveable structure, the landing post being adapted to contact the base of the landing post against the first surface when the electrically activated electrode receives a predetermined voltage bias associated with the first signal, thereby maintaining an outer portion of the moveable structure free from physical contact with the first surface and reducing a magnitude of one or more parasitic forces.
    Type: Application
    Filed: November 19, 2003
    Publication date: May 19, 2005
    Applicant: XHP Microsystems, Inc.
    Inventors: Xiao Yang, Shoucheng Zhang, Dongmin Chen, Jie Chen
  • Publication number: 20050101059
    Abstract: A method for hermetically sealing devices. The method includes providing a substrate which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The method also provides a transparent member of a predetermined thickness which includes a plurality of recessed regions arranged in a spatial manner as a second array and a standoff region. The method also includes aligning the transparent member in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. The method further includes hermetically sealing each of the chips within one of the respective recessed regions by using at least a bonding process to isolate each of the chips within one of the recessed regions.
    Type: Application
    Filed: October 24, 2003
    Publication date: May 12, 2005
    Applicant: XHP Microsystems, Inc.
    Inventor: Xiao Yang
  • Publication number: 20040207924
    Abstract: A color separation method and system wherein an optical spectrum is separated into optical wavelength ranges and wherein the optical signals of the separated wavelength ranges are further separated temporally. The optical spectrum can be spatially dispersed and the optical signals can be temporally dispersed, with three optical signals representing primary colors, such as red, green and blue.
    Type: Application
    Filed: January 12, 2004
    Publication date: October 21, 2004
    Applicant: XHP Microsystems, Inc.
    Inventor: Jie Chen